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• Low-power 3.3-V, 0.18-µm CMOS Technology
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• Low power Consumption <600 mW Typical
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• 3.3-V MAC Interface
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• Auto-MDIX for 10/100 Mb/s
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• Energy Detection Mode
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• Flexible MII Port Assignment
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• Dynamic Integrity Utility
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| CATALOG |
DP83849IVSX/NOPB COUNTRY OF ORIGIN
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DP83849IVSX/NOPB PARAMETRIC INFO
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DP83849IVSX/NOPB PACKAGE INFO
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DP83849IVSX/NOPB MANUFACTURING INFO
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DP83849IVSX/NOPB PACKAGING INFO
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DP83849IVSX/NOPB ECAD MODELS
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DP83849IVSX/NOPB APPLICATIONS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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Philippines
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PARAMETRIC INFO
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| Type |
Fast Ethernet Transceiver |
| Maximum Data Rate |
100Mbps |
| Number of Channels per Chip |
2 |
| PHY Line Side Interface |
No |
| JTAG Support |
Yes |
| Standard Supported |
10BASE-T|100BASE-TX |
| Typical Data Rate (Mbps) |
10/100 |
| Integrated CDR |
No |
| Overhead Octet Support |
No |
| Maximum Power Dissipation (mW) |
594 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Analog |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Operating Supply Voltage (V) |
3.3 |
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PACKAGE INFO
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| Supplier Package |
TQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
80 |
| Lead Shape |
Gull-wing |
| PCB |
80 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
12.2(Max) |
| Package Width (mm) |
12.2(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
14.2(Max) |
| Package Overall Width (mm) |
14.2(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026 |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
4 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • Medical Instrumentation |
| • Factory Automation |
| • Motor and Motion Control |
| • Wireless Remote Base Station |
| • General Embedded Applications |
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