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| CATALOG |
DP83865DVH/NOPB COUNTRY OF ORIGIN
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DP83865DVH/NOPB LIFECYCLE
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DP83865DVH/NOPB PARAMETRIC INFO
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DP83865DVH/NOPB PACKAGE INFO
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DP83865DVH/NOPB MANUFACTURING INFO
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DP83865DVH/NOPB PACKAGING INFO
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DP83865DVH/NOPB ECAD MODELS
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COUNTRY OF ORIGIN
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Malaysia
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LIFECYCLE
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LTB
Feb 11,2026
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PARAMETRIC INFO
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| Type |
Gigabit Ethernet Transceiver |
| Maximum Data Rate |
1Gbps |
| Number of Channels per Chip |
1 |
| PHY Line Side Interface |
No |
| JTAG Support |
Yes |
| Standard Supported |
10BASE-T|1000BASE-T|100BASE-TX |
| Typical Data Rate (Mbps) |
10/100/1000 |
| Integrated CDR |
No |
| Overhead Octet Support |
No |
| Ethernet Interface Type |
GMII/TBI/RGMII/RTBI/SGMII |
| Ethernet Speed |
10Mbps/100Mbps/1000Mbps |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Power Supply Type |
Analog|Digital |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Minimum Operating Supply Voltage (V) |
1.71|2.375|3.135 |
| Maximum Operating Supply Voltage (V) |
1.89|2.625|3.465 |
| Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum Supply Current (mA) |
430(Typ) |
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PACKAGE INFO
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| Supplier Package |
PQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
128 |
| Lead Shape |
Gull-wing |
| PCB |
128 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
20 |
| Package Width (mm) |
14 |
| Package Height (mm) |
2.7 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
23.2 |
| Package Overall Width (mm) |
17.2 |
| Package Overall Height (mm) |
3.4(Max) |
| Seated Plane Height (mm) |
3.4(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.22 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Plastic Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
66 |
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ECAD MODELS
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