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• Pulse width modulation (PWM) microstepping motor driver– Built-In 1/256-Step microstepping indexer– Drives external N-Channel MOSFETs– Optional STEP/DIR pins– Optional PWM control interface for DC motors
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• Flexible decay modes, including automatic mixed decay mode
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• Stall detection with optional BEMF output
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| • Highly configurable SPI serial interface |
| • Internal reference and torque DAC |
| • 8-V to 52-V Operating supply voltage range |
| • Scalable output current |
| • Thermally enhanced surface-mount package |
| • 5-V Regulator capable of 10-mA load |
| • Protection and diagnostic features– Overcurrent protection (OCP)– Overtemperature shutdown (OTS)– Undervoltage lockout (UVLO)– Individual fault condition indication bits– Fault condition indication pin |
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| CATALOG |
| DRV8711DCPR COUNTRY OF ORIGIN |
DRV8711DCPR PARAMETRIC INFO
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DRV8711DCPR PACKAGE INFO
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DRV8711DCPR MANUFACTURING INFO
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DRV8711DCPR PACKAGING INFO
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DRV8711DCPR EACD MODELS
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| DRV8711DCPR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
| Malaysia |
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PARAMETRIC INFO
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| Type |
Motor Controller |
| Maximum Operating Current (mA) |
20 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Supply Voltage (V) |
8 |
| Operating Supply Voltage (V) |
8 to 52 |
| Maximum Operating Supply Voltage (V) |
52 |
| Minimum Storage Temperature (°C) |
-60 |
| Maximum Storage Temperature (°C) |
150 |
| Output Configuration |
Dual H-Bridge |
| Control Interface |
PWM |
| Maximum Output Current (A) |
0.01 |
| Maximum Peak Output Current (A) |
0.4 |
| Step Modes |
1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64, 1/128, 1/256 |
| Motor Type |
Stepper Motor |
| Number of Phases |
2 |
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PACKAGE INFO
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| Supplier Package |
HTSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
38 |
| Lead Shape |
Gull-wing |
| PCB |
38 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
9.8(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9.8(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
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ECAD MODELS
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| APPLICATIONS |
| • Office Automation Machines |
| • Factory Automation |
| • Textile Machines |
| • Robotics |
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