DS18B20+ Analog Devices / Maxim Integrated SENSOR DIGITAL -55C-125C TO92-3

label:
2024/06/6 225

• Unique 1-Wire® Interface Requires Only One Port Pin for Communication
• Reduce Component Count with Integrated Temperature Sensor and EEPROM • Measures Temperatures from -55°C to +125°C (-67°F to +257°F)
• ±0.5°C Accuracy from -10°C to +85°C• Programmable Resolution from 9 Bits to 12 Bits• No External Components Required
• Parasitic Power Mode Requires Only 2 Pins for Operation (DQ and GND)
• Simplifies Distributed Temperature-Sensing Applications with Multidrop Capability• Each Device Has a Unique 64-Bit Serial Code Stored in On-Board ROM
• Flexible User-Definable Nonvolatile (NV) Alarm Settings with Alarm Search Command Identifies Devices with Temperatures Outside Programmed Limits
• Available in 8-Pin SO (150 mils), 8-Pin µSOP, and 3-Pin TO-92 Packages

CATALOG
DS18B20+ COUNTRY OF ORIGIN
DS18B20+ PARAMETRIC INFO
DS18B20+ PACKAGE INFO
DS18B20+ MANUFACTURING INFO
DS18B20+ PACKAGING INFO
DS18B20+ EACD MODELS
DS18B20+ APPLICATIONS



COUNTRY OF ORIGIN
Philippines



PARAMETRIC INFO
Function Temperature Sensor
Interface Type Serial (1-Wire)
Resolution (bit) 12
Output Type Digital
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Temperature Sensing (°C) -55
Maximum Temperature Sensing (°C) 125
Operating Range -55°C to 125°C
Operating Temperature (°C) -55 to 125
Maximum Supply Current (uA) 1500
Accuracy ±2°C(Max)
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Output Driver Open Drain
Operating Supply Voltage (V) 3 to 5.5
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 125



PACKAGE INFO
Supplier Package TO-92
Basic Package Type Through Hole
Pin Count 3
Lead Shape Through Hole
PCB 3
Tab N/R
Pin Pitch (mm) 1.4(Max)
Package Length (mm) 4.95(Max)
Package Width (mm) 3.94(Max)
Package Height (mm) 4.95(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 4.95(Max)
Mounting Through Hole
Package Material Plastic
Package Description Plastic Header Style Package
Package Family Name TO
Jedec N/A
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Number of Reflow Cycle N/R
Standard N/R
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu C194
Number of Wave Cycles N/A



PACKAGING INFO
Packaging Bag
Quantity Of Packaging 2000



ECAD MODELS




APPLICATIONS
• Thermostatic Controls
• Industrial Systems
• Consumer Products
• Thermometers
• Thermally Sensitive Systems
Продукт RFQ