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• 256-bit Electrically Erasable ProgrammableRead Only Memory (EEPROM) plus 64-bitone-time programmable application register
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• Unique, factory-lasered and tested 64-bitregistration number (8-bit family code + 48-bitserial number + 8-bit CRC tester) assuresabsolute identity because no two parts are alike
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• Built-in multidrop controller ensurescompatibility with other MicroLAN products
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• EEPROM organized as one page of 32 bytesfor random access
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• Reduces control, address, data, and power to asingle data pin
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• Directly connects to a single port pin of amicroprocessor and communicates at up to15.3kbits per second
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• 8-bit family code specifies DS2430Acommunication requirements to reader
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• Presence detector acknowledges when readerfirst applies voltage
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• Low cost TO-92 or 6-pin TSOC and UCSPsurface mount package
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• Reads and writes over a wide voltage range of 2.8V to 5.25V from -40°C to +85°C
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| CATALOG |
DS2430AP+ Country of Origin
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DS2430AP+ Parametric Info
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DS2430AP+ Package Info
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DS2430AP+ Manufacturing Info
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DS2430AP+ Packaging Info
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DS2430AP+ ECAD Models
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DS2430AP+ functional BLOCK DIAGRAM
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COUNTRY OF ORIGIN
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China
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Density (bit) |
256 |
| Interface Type |
Serial-1Wire |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Programmability |
Yes |
| Density in Bits (bit) |
256 |
| Hardware Data Protection |
Yes |
| Organization |
32x8 |
| Data Retention (Year) |
40(Min) |
| Minimum Operating Supply Voltage (V) |
2.8 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Minimum Storage Temperature (°C) |
-55 |
| Number of Bits per Word (bit) |
8 |
| Maximum Storage Temperature (°C) |
125 |
| Address Bus Width (bit) |
8 |
| Process Technology |
BiCMOS |
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PACKAGE INFO
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| Supplier Package |
TSOC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
J-Lead |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
N/A |
| Package Width (mm) |
N/A |
| Package Height (mm) |
N/A |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
N/A |
| Package Overall Width (mm) |
N/A |
| Package Overall Height (mm) |
1.4 |
| Seated Plane Height (mm) |
1.4 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
N/A |
| Package Family Name |
N/A |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu C194 |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
120 |
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ECAD MODELS
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| FUNCTIONAL BLOCK DIAGRAM |
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