DS2431+ Maxim Integrated IC EEPROM 1K 1WIRE TO92-3

label:
2023/11/8 388


● Easily Add Traceability and Relevant Information to Any Individual System
   • 1024 Bits of EEPROM Memory Partitioned Into Four Pages of 256 Bits
   • Individual Memory Pages Can Be Permanently Write Protected or Put in EPROM-Emulation Mode (Write to 0)
   • Switchpoint Hysteresis and Filtering to Optimize Performance in the Presence of Noise
● Minimalist 1-Wire Interface Lowers Cost and Interface Complexity
   • IEC 1000-4-2 Level 4 ESD Protection (±8kV Contact, ±15kV Air, typ)
   • Reads and Writes Over a Wide Voltage Range from 2.8V to 5.25V from -40°C to +85°C
   • Communicates to Host with a Single Digital Signal at 15.4kbps or 125kbps


CATALOG
DS2431+ COUNTRY OF ORIGIN
DS2431+ PARAMETRIC INFO
DS2431+ PACKAGE INFO
DS2431+ MANUFACTURING INFO
DS2431+ PACKAGING INFO
DS2431+ ECAD MODELS
DS2431+ APPLICATIONS


COUNTRY OF ORIGIN
Philippines
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 1K
Interface Type Serial-1Wire
Typical Operating Supply Voltage (V) 3.3|5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Programmability Yes
I/O Mode Serial
Density in Bits (bit) 1024
Hardware Data Protection Yes
Organization 4Pagesx256
Data Retention (Year) 40(Min)
Minimum Operating Supply Voltage (V) 2.8
Maximum Operating Supply Voltage (V) 5.25
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 125
Number of Bits per Word (bit) 1
Address Bus Width (bit) 16
Process Technology BiCMOS
 
PACKAGE INFO
Supplier Package TO-92
Basic Package Type Through Hole
Pin Count 3
Lead Shape Through Hole
PCB 3
Tab N/R
Pin Pitch (mm) 1.4(Max)
Package Length (mm) 4.95(Max)
Package Width (mm) 3.94(Max)
Package Height (mm) 4.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 4.95(Max)
Package Overall Width (mm) 3.94(Max)
Package Overall Height (mm) 4.95(Max)
Seated Plane Height (mm) 4.95(Max)
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Header Style Package
Package Family Name TO
Jedec TO-226-AA
 
MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) 250
Reflow Solder Time (Sec) N/A
Number of Reflow Cycle N/A
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu C194
Number of Wave Cycles N/A
 
PACKAGING INFO
Packaging Bag
Quantity Of Packaging 2000
 
ECAD MODELS

 
APPLICATIONS
● Accessory/PCB Identification
● Medical Sensor Calibration Data Storage
● Analog Sensor Calibration Including IEEE P1451.4 Smart Sensors
● Ink and Toner Print Cartridge Identification
● After-Market Management of Consumables


Продукт RFQ