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● Easily Add Traceability and Relevant Information to
Any Individual System
• 1024 Bits of EEPROM Memory Partitioned Into
Four Pages of 256 Bits
• Individual Memory Pages Can Be Permanently
Write Protected or Put in EPROM-Emulation Mode
(Write to 0)
• Switchpoint Hysteresis and Filtering to Optimize
Performance in the Presence of Noise |
● Minimalist 1-Wire Interface Lowers Cost and
Interface Complexity
• IEC 1000-4-2 Level 4 ESD Protection
(±8kV Contact, ±15kV Air, typ)
• Reads and Writes Over a Wide Voltage Range
from 2.8V to 5.25V from -40°C to +85°C
• Communicates to Host with a Single Digital Signal
at 15.4kbps or 125kbps |
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CATALOG |
DS2431+ COUNTRY OF ORIGIN |
DS2431+ PARAMETRIC INFO |
DS2431+ PACKAGE INFO |
DS2431+ MANUFACTURING INFO |
DS2431+ PACKAGING INFO |
DS2431+ ECAD MODELS |
DS2431+ APPLICATIONS |
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COUNTRY OF ORIGIN |
Philippines |
Taiwan (Province of China) |
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PARAMETRIC INFO |
Density (bit) |
1K |
Interface Type |
Serial-1Wire |
Typical Operating Supply Voltage (V) |
3.3|5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Programmability |
Yes |
I/O Mode |
Serial |
Density in Bits (bit) |
1024 |
Hardware Data Protection |
Yes |
Organization |
4Pagesx256 |
Data Retention (Year) |
40(Min) |
Minimum Operating Supply Voltage (V) |
2.8 |
Maximum Operating Supply Voltage (V) |
5.25 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
125 |
Number of Bits per Word (bit) |
1 |
Address Bus Width (bit) |
16 |
Process Technology |
BiCMOS |
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PACKAGE INFO |
Supplier Package |
TO-92 |
Basic Package Type |
Through Hole |
Pin Count |
3 |
Lead Shape |
Through Hole |
PCB |
3 |
Tab |
N/R |
Pin Pitch (mm) |
1.4(Max) |
Package Length (mm) |
4.95(Max) |
Package Width (mm) |
3.94(Max) |
Package Height (mm) |
4.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
4.95(Max) |
Package Overall Width (mm) |
3.94(Max) |
Package Overall Height (mm) |
4.95(Max) |
Seated Plane Height (mm) |
4.95(Max) |
Mounting |
Through Hole |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Plastic Header Style Package |
Package Family Name |
TO |
Jedec |
TO-226-AA |
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MANUFACTURING INFO |
MSL |
N/R |
Maximum Reflow Temperature (°C) |
250 |
Reflow Solder Time (Sec) |
N/A |
Number of Reflow Cycle |
N/A |
Standard |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/A |
Wave Solder Time (Sec) |
N/A |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu C194 |
Number of Wave Cycles |
N/A |
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PACKAGING INFO |
Packaging |
Bag |
Quantity Of Packaging |
2000 |
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ECAD MODELS |
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APPLICATIONS |
● Accessory/PCB Identification |
● Medical Sensor Calibration Data Storage |
● Analog Sensor Calibration Including IEEE P1451.4
Smart Sensors |
● Ink and Toner Print Cartridge Identification |
● After-Market Management of Consumables |
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