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• Low Power CMOS Design (30 mW typical)
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• Interoperable with Existing 5V RS-422
Networks
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• Industrial and Military Temperature Range
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• 3.3V Operation
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• ±7V Common Mode Range @ VID = 3V
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• ±10V Common Mode Range @ VID = 0.2V
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| CATALOG |
| DS26LV32ATM/NOPB COUNTRY OF ORIGIN |
DS26LV32ATM/NOPB PARAMETRIC INFO
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DS26LV32ATM/NOPB PACKAGE INFO
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DS26LV32ATM/NOPB MANUFACTURING INFO
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DS26LV32ATM/NOPB PACKAGING INFO
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DS26LV32ATM/NOPB ECAD MODELS
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COUNTRY OF ORIGIN
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| Malaysia |
Philippines
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PARAMETRIC INFO
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| Function |
Line Receiver |
| Number of Receivers |
4 |
| Receiver Signal Type |
Differential |
| Charge Pump |
No |
| Output Logic Level |
TTL|LVCMOS |
| Receiver Communication Type |
RS-422 |
| Interface Standards |
RS-422 |
| Number of Receiver Enables |
1 |
| Number of Receivers per Line |
1 |
| Driving Mode |
3-State |
| Process Technology |
CMOS |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
3.3 |
| Minimum Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
3.6 |
| Maximum Supply Current (mA) |
15 |
| Isolation |
No |
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PACKAGE INFO
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| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AC |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
48 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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