 |
|
• Low Power CMOS Design (30 mW typical)
|
| • Interoperable with Existing 5V RS-422
Networks |
| • Industrial and Military Temperature Range |
| • Conforms to TIA/EIA-422-B (RS-422) and ITU-T V.11 Recommendation |
| • 3.3V Operation |
| • ±7V Common Mode Range @ VID = 3V |
| • ±10V Common Mode Range @ VID = 0.2V |
| • Receiver OPEN Input Failsafe Feature |
• Guaranteed AC Parameter:
– Maximum Receiver Skew: 4 ns
– Maximum Transition Time: 10 ns |
| • Pin Compatible with DS26C32AT |
| • 32 MHz Toggle Frequency
|
| • > 6.5k ESD Tolerance (HBM) |
| • Available in SOIC and CLGA Packaging
|
| • Standard Microcircuit Drawing (SMD) 5962- 98585 |
|
| CATALOG |
| DS26LV32ATMX/NOPB COUNTRY OF ORIGIN |
| DS26LV32ATMX/NOPB PARAMETRIC INFO |
| DS26LV32ATMX/NOPB PACKAGE INFO |
| DS26LV32ATMX/NOPB MANUFACTURING INFO |
| DS26LV32ATMX/NOPB PACKAGING INFO |
| DS26LV32ATMX/NOPB ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
| Philippines |
| Taiwan (Province of China) |
| Thailand |
| United States of America |
|
| PARAMETRIC INFO |
| Function |
Line Receiver |
| Number of Receivers |
4 |
| Receiver Signal Type |
Differential |
| Charge Pump |
No |
| Input Logic Level |
TTL|LVCMOS |
| Output Logic Level |
TTL|LVCMOS |
| Receiver Communication Type |
RS-422 |
| Interface Standards |
RS-422 |
| Number of Receiver Enables |
1 |
| Number of Receivers per Line |
1 |
| Driving Mode |
3-State |
| Process Technology |
CMOS |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
3.3 |
| Minimum Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
3.6 |
| Maximum Supply Current (mA) |
15 |
| Isolation |
No |
|
| PACKAGE INFO |
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AC |
| Package Outline |
Link to Datasheet |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
4 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
|
| ECAD MODELS |
 |
|
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