DS28EC20+T Analog Devices / Maxim Integrated IC EEPROM 20K 1WIRE TO92-3

label:
2023/11/23 369



• 20480 Bits of Nonvolatile (NV) EEPROM Partitioned into Eighty 256-Bit Pages
• Individual 8-Page Groups of Memory Pages (Blocks) can be Permanently Write Protected or Put in OTP EPROM-Emulation Mode ("Write to 0")
• Read and Write Access Highly BackwardCompatible to Legacy Devices (e.g., DS2433)
• 256-Bit Scratchpad with Strict Read/Write Protocols Ensures Integrity of Data Transfer
• 200k Write/Erase Cycle Endurance at +25°C
• Unique Factory-Programmed 64-Bit Registration Number Ensures Error-Free Device Selection and Absolute Part Identity
• Switchpoint Hysteresis and Filtering to Optimize Performance in the Presence of Noise
• Communicates to Host at 15.4kbps or 90kbps Using 1-Wire Protocol
• Low-Cost TO-92 Package
• Operating Range: 4V to 5.25V, -40°C to +85°C
• Operating Range: 3.135V to3.465V, 0°C to +70°C (Standard Speed only)
• IEC 1000-4-2 Level 4 ESD Protection (±8kV Contact, ±15kV Air, Typical) for I/O Pin


CATALOG
DS28EC20+T COUNTRY OF ORIGIN
DS28EC20+T PARAMETRIC INFO
DS28EC20+T PACKAGE INFO
DS28EC20+T MANUFACTURING INFO
DS28EC20+T PACKAGING INFO
DS28EC20+T ECAD MODELS
DS28EC20+T APPLICATIONS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Density (bit) 20K
Interface Type Serial-1Wire
Typical Operating Supply Voltage (V) 5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Programmability Yes
I/O Mode Serial
Density in Bits (bit) 20480
Hardware Data Protection Yes
Organization 80Pagesx256
Data Retention (Year) 40(Min)
Minimum Operating Supply Voltage (V) 4
Maximum Operating Supply Voltage (V) 5.25
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 125
Number of Bits per Word (bit) 1
Address Bus Width (bit) 16


PACKAGE INFO
Supplier Package TO-92
Basic Package Type Through Hole
Pin Count 3
Lead Shape Through Hole
PCB 3
Tab N/R
Pin Pitch (mm) 1.4(Max)
Package Length (mm) 4.95(Max)
Package Width (mm) 3.94(Max)
Package Height (mm) 4.95(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 4.95(Max)
Mounting Through Hole
Package Material Plastic
Package Description Plastic Header Style Package
Package Family Name TO
Jedec N/A


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu C194


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 2000


ECAD MODELS



APPLICATIONS
• Device Authentication
• IEEE 1451.4 Sensor TEDS
• Ink/Toner Cartridges
• Medical Sensors
• PCB Identification
• Wireless Base Stations
Продукт RFQ