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| • Automotive Grade Device, AEC-Q100 Grade 3 Qualified |
| • Operating Temperature Range: –40°C to +85°C |
| • 20 to 65 MHz Shift Clock Support |
| • 50% Duty Cycle on Receiver Output Clock |
| • Best–in–Class Set & Hold Times on RxOUTPUTs |
| • Rx Power Consumption <142 mW (typ) @65MHz Grayscale |
| • Rx Power-down Mode <200μW (max) |
| • ESD Rating >7 kV (HBM), >700V (EIAJ) |
| • Supports VGA, SVGA, XGA and Dual Pixel SXGA. |
| • PLL Requires No External Components |
| • Compatible with TIA/EIA-644 LVDS Standard |
| • Low Profile 56-Lead TSSOP Package |
|
| CATALOG |
| DS90CF384AQMTX/NOPB COUNTRY OF ORIGIN |
| DS90CF384AQMTX/NOPB PARAMETRIC INFO |
| DS90CF384AQMTX/NOPB PACKAGE INFO |
| DS90CF384AQMTX/NOPB MANUFACTURING INFO |
| DS90CF384AQMTX/NOPB PACKAGING INFO |
| DS90CF384AQMTX/NOPB ECAD MODEL |
| DS90CF384AQMTX/NOPB FUNCTONAL BLOCK DIAGRAM |
|
| COUNTRY OF ORIGIN |
| Malaysia |
|
| PARAMETRIC INFO |
| Function |
Receiver |
| Number of Drivers |
0 |
| Number of Receivers |
4 |
| Input Signal Type |
LVCMOS|LVTTL |
| Transmission Data Rate (Mbps) |
1800 |
| Number of Elements per Chip |
4 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Input Current (uA) |
10 |
| Output Signal Type |
LVDS |
| Differential Input High Threshold Voltage (V) |
0.1 |
| Differential Input Low Threshold Voltage (V) |
-0.1 |
| Maximum Power Dissipation (mW) |
1610 |
| Minimum Operating Frequency (MHz) |
20 |
| Maximum Operating Frequency (MHz) |
65 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
| |
| PACKAGE INFO |
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
56 |
| Lead Shape |
Gull-wing |
| PCB |
56 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
14.1(Max) |
| Package Width (mm) |
6.2(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
14.1(Max) |
| Package Overall Width (mm) |
8.3(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
MO-153ED |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
X |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODEL |
 |
|
| FUNCTONAL BLOCK DIAGRAM |
 |
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