DS90UB954TRGZRQ1 Texas Instruments DUAL FPD LINK DESERIALIZER HUB W

label:

2023/11/14 478

• AEC-Q100 qualified for automotive applications
– Device temperature grade 2: –40℃ to +105℃ ambient operating temperature range

• Dual deserializer hub aggregates one or two active sensors over FPD-Link III interface

• Power-Over-Coax (PoC) compatible transceiver

• MIPI DPHY Version 1.2 / CSI-2 Version 1 .3 compliant
– CSI-2 output ports
– Supports 1, 2, 3, 4 data lanes
– CSI-2 data rate scalable for 400 Mbps / 800 Mbps / 1.5 Gbps / 1.6 Gbps each data lane
– Programmable data types
– Four virtual channels – ECC and CRC generation

• 2x2 Output replication mode

• Ultra-low data and control path latency

• Supports single-ended coaxial or Shielded Twisted-Pair (STP) cable

• Adaptive receive equalization

• I2C with fast-mode plus up to 1 Mbps

• Flexible GPIOs for camera synchronization and diagnostics

• Compatible with DS90UB935-Q1, DS90UB953- Q1, DS90UB933-Q1 and DS90UB913A-Q1 serializers

• Line fault detection and advanced diagnostics

• ISO 10605 and IEC 61000-4-2 ESD compliant

CATALOG

DS90UB954TRGZRQ1 COUNTRY OF ORIGIN

DS90UB954TRGZRQ1 PARAMETRIC INFO

DS90UB954TRGZRQ1 PACKAGE INFO

DS90UB954TRGZRQ1 MANUFACTURING INFO

DS90UB954TRGZRQ1 PACKAGING INFO

DS90UB954TRGZRQ1 ECAD MODELS

DS90UB954TRGZRQ1 FUNCTIONAL BLOCK DIAGRAM

DS90UB954TRGZRQ1APPLICATIONS

COUNTRY OF ORIGIN

Philippines

PARAMETRIC INFO

Function	Deserializer
Number of Drivers	1
Number of Receivers	1
Input Signal Type	LVCMOS
Transmission Data Rate (Mbps)	4160
Number of Elements per Chip	1
Minimum Operating Supply Voltage (V)	1.045\|1.71
Typical Operating Supply Voltage (V)	1.1\|1.8
Maximum Operating Supply Voltage (V)	1.155\|1.89
Output Signal Type	LVCMOS
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	105
Supplier Temperature Grade	Automotive
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	VQFN EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	48
Lead Shape	No Lead
PCB	48
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	7.15(Max)
Package Width (mm)	7.15(Max)
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	7.15(Max)
Package Overall Width (mm)	7.15(Max)
Package Overall Height (mm)	1(Max)
Seated Plane Height (mm)	1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Very Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name	QFN
Jedec	MO-220

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy

PACKAGING INFO

Packaging Suffix	R
Packaging	Tape and Reel
Quantity Of Packaging	2500

ECAD MODELS

FUNCTIONAL BLOCK DIAGRAM

APPLICATIONS

• Automotive ADAS
– Rear View Cameras (RVC)
– Surround View Systems (SVS)
– Camera Monitor Systems (CMS)
– Forward Vision Cameras (FC)
– Driver Monitoring Systems (DMS)
– Satellite RADAR, Time of Flight (ToF) and LIDAR Sensor Modules

• Security and Surveillance

• Industrial and Medical Imaging