  
       | 
    
    
      |   | 
    
    
      •    Very low VF 
       | 
    
    
      •              Extremely low switching losses  
       | 
    
    
      • Low IRM values 
       | 
    
    
      | • Improved thermal behavior  | 
    
    
      | • High reliability circuit operation  | 
    
    
      | • Low voltage peaks for reduced protection circuits  | 
    
    
      | • Low noise switching  | 
    
    
      | • Terminals finish: 100% Pure Tin   | 
    
    
      | • This is a Pb-free device  | 
    
    
      | • Epoxy meets UL 94V-0  | 
    
    
      |   | 
    
    
      | CATALOG | 
    
    
      | DSA120C150QB COUNTRY OF ORIGIN | 
    
    
      DSA120C150QB PARAMETRIC INFO 
       | 
    
    
      DSA120C150QB PACKAGE INFO 
       | 
    
    
      DSA120C150QB MANUFACTURING INFO 
       | 
    
    
      | DSA120C150QB APPLICATIONS  | 
    
    
        
       
       
       | 
    
    
      | COUNTRY OF ORIGIN | 
    
    
      | Korea (Republic of)  | 
    
    
        
       
       
       | 
    
    
      PARAMETRIC INFO 
       | 
    
    
      
      
      
        
        
        
          
            | Type | 
            Schottky Diode | 
           
          
            | Configuration | 
            Dual Common Cathode | 
           
          
            | Maximum DC Reverse Voltage (V) | 
            150 | 
           
          
            | Peak Reverse Repetitive Voltage (V) | 
            150 | 
           
          
            | Maximum Continuous Forward Current (A) | 
            120 | 
           
          
            | Maximum Power Dissipation (mW) | 
            375000 | 
           
          
            | Peak Forward Voltage (V) | 
            0.93@60A | 
           
          
            | Peak Non-Repetitive Surge Current (A) | 
            800 | 
           
          
            | Peak Reverse Current (uA) | 
            900 | 
           
          
            | Operating Junction Temperature (°C) | 
            -55 to 175 | 
           
          
            | Minimum Storage Temperature (°C) | 
            -55 | 
           
          
            | Maximum Storage Temperature (°C) | 
            150 | 
           
          
            | Minimum Operating Temperature (°C) | 
            -55 | 
           
          
            | Maximum Operating Temperature (°C) | 
            150 | 
           
        
       
       
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      PACKAGE INFO 
       | 
    
    
      
      
      
        
        
        
          
            | Supplier Package | 
            TO-3P | 
           
          
            | Basic Package Type | 
            Through Hole | 
           
          
            | Pin Count | 
            3 | 
           
          
            | Lead Shape | 
            Through Hole | 
           
          
            | PCB | 
            3 | 
           
          
            | Tab | 
            Tab | 
           
          
            | Pin Pitch (mm) | 
            5.45 | 
           
          
            | Package Length (mm) | 
            15.8(Max) | 
           
          
            | Package Width (mm) | 
            4.9(Max) | 
           
          
            | Package Height (mm) | 
            N/A | 
           
          
            | Package Diameter (mm) | 
            N/R | 
           
          
            | Seated Plane Height (mm) | 
            23.9(Max) | 
           
          
            | Mounting | 
            Through Hole | 
           
          
            | Package Material | 
            Plastic | 
           
          
            | Package Description | 
            Transistor Outline Package | 
           
          
            | Package Family Name | 
            TO | 
           
          
            | Jedec | 
            N/A | 
           
          
            | Package Outline | 
            Link to Datasheet | 
           
        
       
       
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      MANUFACTURING INFO 
       | 
    
    
      
      
      
        
        
        
          
            | MSL | 
            N/R | 
           
          
            | Maximum Reflow Temperature (°C) | 
            N/R | 
           
          
            | Reflow Solder Time (Sec) | 
            N/R | 
           
          
            | Maximum Wave Temperature (°C) | 
            N/A | 
           
          
            | Wave Solder Time (Sec) | 
            N/A | 
           
          
            | Wave Temp. Source | 
            Link to Datasheet | 
           
          
            | Lead Finish(Plating) | 
            Sn | 
           
          
            | Under Plating Material | 
            N/A | 
           
          
            | Terminal Base Material | 
            N/A | 
           
        
       
       
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      | APPLICATIONS  | 
    
    
      | •  Rectifiers in switch mode power supplies (SMPS)
       | 
    
    
      | • Free wheeling diode in low voltage converters  | 
    
    
       
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      |   |