DSPIC33CK256MP505-I/PT Microchip Technology 16 BIT DSC, 256KB FLASH, 24KB RA

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September 8th, 2025 0
DSPIC33CK256MP505-I/PT Microchip Technology 16 BIT DSC, 256KB FLASH, 24KB RA


CATALOG
DSPIC33CK256MP505-I/PT COUNTRY OF ORIGIN
DSPIC33CK256MP505-I/PT PARAMETRIC INFO
DSPIC33CK256MP505-I/PT PACKAGE INFO
DSPIC33CK256MP505-I/PT PACKAGING INFO
DSPIC33CK256MP505-I/PT ECAD MODELS


COUNTRY OF ORIGIN
Philippines
Thailand


PARAMETRIC INFO
Family Name dSPIC33
Data Bus Width (bit) 16
Device Core dsPIC
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 100
Program Memory Type Flash
Program Memory Size 256KB
RAM Size 24KB
Maximum CPU Frequency (MHz) 100
GPIO 39
Number of Timers 1
ADC Channels 19/19/19
ADC Resolution (bit) 12/12/12
Core Architecture PIC
Number of ADCs 3
Number of DACs 3
DAC Resolution (bit) 12/12/12
Watchdog 1
Analog Comparators 3
Parallel Master Port Yes
Interface Type CAN/I2C/SPI/UART
Programmability Yes
SPI 3
I2C 3
I2S 0
UART 3
USART 0
CAN 1
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 48
Lead Shape Gull-wing
PCB 48
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 7
Package Width (mm) 7
Package Height (mm) 1
Package Diameter (mm) N/R
Package Overall Length (mm) 9
Package Overall Width (mm) 9
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Jedec MS-026ABC
Package Outline Link to Datasheet


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 250


ECAD MODELS


Product RFQ