DSPIC33CK32MP506-E/PT Microchip Technology 16 BIT DSC, 32KB FLASH, 8KB RAM,

label:
2024/08/22 189
DSPIC33CK32MP506-E/PT Microchip Technology 16 BIT DSC, 32KB FLASH, 8KB RAM,


DSPIC33CK32MP506-E/PT COUNTRY OF ORIGIN
DSPIC33CK32MP506-E/PT PARAMETRIC INFO
DSPIC33CK32MP506-E/PT PACKAGE INFO
DSPIC33CK32MP506-E/PT PACKAGING INFO
DSPIC33CK32MP506-E/PT ECAD MODELS


COUNTRY OF ORIGIN
Philippines
Thailand
Korea (Republic of)
China
Malaysia


PARAMETRIC INFO
Family Name dSPIC33
Data Bus Width (bit) 16
Device Core dsPIC
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 100
Program Memory Type Flash
Program Memory Size 32KB
RAM Size 8KB
Maximum CPU Frequency (MHz) 100
Number of Programmable I/Os 53
Number of Timers 1
ADC Channels 20/20/20
ADC Resolution (bit) 12/12/12
Core Architecture PIC
Number of ADCs Triple
DAC Resolution (bit) 12/12/12
Number of DACs Triple
Watchdog 1
Analog Comparators 3
Parallel Master Port Yes
Interface Type CAN/I2C/SPI/UART
Programmability Yes
SPI 3
I2C 3
I2S 0
UART 3
USART 0
CAN 1
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Temperature Flag Opr
Supplier Temperature Grade Extended
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 64
Lead Shape Gull-wing
PCB 64
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 10
Package Width (mm) 10
Package Height (mm) 1
Package Diameter (mm) N/R
Package Overall Length (mm) 12
Package Overall Width (mm) 12
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Package Outline Link to Datasheet


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 160
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ