DSPIC33EP512GP806-I/PT Microchip Technology IC MCU 16BIT 512KB FLASH 64TQFP

label:
2024/04/8 210


CATALOG
DSPIC33EP512GP806-I/PT COUNTRY OF ORIGIN
DSPIC33EP512GP806-I/PT PARAMETRIC INFO
DSPIC33EP512GP806-I/PT PACKAGE INFO
DSPIC33EP512GP806-I/PT MANUFACTURING INFO
DSPIC33EP512GP806-I/PT PACKAGING INFO
DSPIC33EP512GP806-I/PT EACD MODELS


COUNTRY OF ORIGIN
Malaysia
Philippines
Thailand
China
Korea (Republic of)



PARAMETRIC INFO
Series name dsPIC33E
Data Bus Width (bit) 16
Device Core dsPIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 70
Program Memory Type Flash
Program Memory Size 536KB
RAM Size 52KB
Maximum Expanded Memory Size 4MB
Maximum CPU Frequency (MHz) 70
Floating Point Unit no
Bluetooth no
Wi-Fi no
External Bus Interface no
DMA Channels 4
Multiply Accumulate no
Internal/External Clock Type External
Touch Sensing Interface no
Power On Reset no
Memory Protection Unit no
Temperature Sensor no
DDR no
Memory Management Unit no
Integrated Development Environment no
Super Scalar no
Direct Memory Access yes
Number of Programmable I/Os 53
Number of Timers 9
ADC Channels 24/24
ADC Resolution (bit) 10/10
Core Architecture dsPIC
Number of ADCs Dual
PWM 7
Watchdog 1
Analog Comparators 3
Special Features CAN Controller
Interface Type CAN/I2C/SPI/UART
Programmability yes
SPI 4
I2C 2
I2S 0
UART 4
USART 0
CAN 2
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Rating Industrial
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging TQFP
Basic package type Lead-Frame SMT
Number of pins 64
Pin shape Gull-wing
PCB 64
ears N/R
Package length (mm) 10
Package width (mm) 10
Package height (mm) 1
Package diameter (mm) N/R
Install Surface Mount
Packaging materials Plastic
package instruction Thin Quad Flat Package
Package series name QFP
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1|3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 20 to 40
Number of reflow cycles 3
standard J-STD-020C
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Wave soldering temperature source Link to datasheet
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Package Tray
Packing quantity 160


ECAD MODELS

Продукт RFQ