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• Epitaxial Planar Die Construction
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• Complementary PNP Type Available (DXTA92)
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• Ideally Suited for Automated Assembly Processes
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• Ideal for Medium Power Switching or Amplification Applications
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• Lead Free By Design/RoHS Compliant (Note 1)
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• "Green" Device (Note 2)
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| CATALOG |
DXTA42-13 COUNTRY OF ORIGIN
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DXTA42-13 PARAMETRIC INFO
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DXTA42-13 PACKAGE INFO
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DXTA42-13 MANUFACTURING INFO
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DXTA42-13 PACKAGING INFO
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COUNTRY OF ORIGIN
|
China
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|
PARAMETRIC INFO
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| Type |
NPN |
| Configuration |
Single Dual Collector |
| Maximum Collector-Emitter Voltage (V) |
300 |
| Maximum Collector Base Voltage (V) |
300 |
| Maximum Emitter Base Voltage (V) |
6 |
| Maximum DC Collector Current (A) |
0.5 |
| Maximum Power Dissipation (mW) |
1000 |
| Maximum Collector-Emitter Saturation Voltage (V) |
0.5@2mA@20mA |
| Maximum Base Emitter Saturation Voltage (V) |
0.9@2mA@20mA |
| Category |
Bipolar Power |
| Minimum DC Current Gain |
25@1mA@10V|40@10mA@10V|40@30mA@10V |
| Number of Elements per Chip |
1 |
| Maximum Transition Frequency (MHz) |
50(Min) |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
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|
PACKAGE INFO
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| Supplier Package |
SOT-89 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
4 |
| Lead Shape |
Flat |
| PCB |
3 |
| Tab |
Tab |
| Pin Pitch (mm) |
1.5 |
| Package Length (mm) |
4.6(Max) |
| Package Width (mm) |
2.6(Max) |
| Package Height (mm) |
1.6(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.6(Max) |
| Package Overall Width (mm) |
4.25(Max) |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-243AA |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
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PACKAGING INFO
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| Packaging Suffix |
13 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Tab Opposing Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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