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■ Operating power supply voltage range
4.5 V VS 36 V (40 V for transients) |
■ Reverse supply (battery) protected down to
VS -24 V |
■ Standby mode with very low current
consumption ISSB 1 mA @ VCC 0.5 V |
■ Low quiescent current in off condition
ISOFF = 120 µA |
■ TTL compatible TX input |
■ Bidirectional K-I/O pin with supply voltage
dependent input threshold |
■ Overtemperature shut down function Selective
to K-I/O pin |
■ Wide input and output voltage range
-24 V VK VS |
■ K output current limitation, typ. IK = 60 mA |
■ Defined OFF output status in undervoltage
condition and VS or GND interruption |
■ Controlled output slope for low EMI |
■ High input impedance for open VS or GND
connection |
■ Defined output ON status of LO or RX for open
LI or K inputs |
■ Defined K output OFF for TX input open |
■ Integrated pull up resistors for TX, RX and LO |
■ EMI robustness optimized |
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CATALOG |
E-L9637D013TR COUNTRY OF ORIGIN |
E-L9637D013TR PARAMETRIC INFO |
E-L9637D013TR PACKAGE INFO |
E-L9637D013TR MANUFACTURING INFO |
E-L9637D013TR PACKAGING INFO |
E-L9637D013TR ECAD MODELS |
E-L9637D013TR FUNCTIONAL BLOCK DIAGRAM |
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COUNTRY OF ORIGIN |
Thailand |
Malaysia |
China |
Morocco |
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PARAMETRIC INFO |
Type |
Transceiver |
Protocols Supported |
ISO 9141 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Supplier Temperature Grade |
Automotive |
Power Supply Type |
Single |
Minimum Single Supply Voltage (V) |
4.5 |
Maximum Single Supply Voltage (V) |
36 |
Maximum Supply Current (mA) |
2.3 |
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PACKAGE INFO |
Supplier Package |
SO N |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.65(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC Narrow Body |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
IPC-1752 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
Number of Wave Cycles |
N/R |
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PACKAGING INFO |
Packaging Suffix |
TR |
Packaging |
Tape and Reel |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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