|
|
• Superectifier structure for high reliability condition
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• Cavity-free glass-passivated junction
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• Ideal for automated placement
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• Ultrafast reverse recovery time
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• Low switching losses, high efficiency
|
| • Avalanche surge energy capability |
| • Meets environmental standard MIL-S-19500 |
| • Meets MSL level 1, per J-STD-020, LF maximum peak
of 250 °C |
| • AEC-Q101 qualified |
| • Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912 |
|
| CATALOG |
EGF1T-E3/67A COUNTRY OF ORIGIN
|
EGF1T-E3/67A PARAMETRIC INFO
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EGF1T-E3/67A PACKAGE INFO
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EGF1T-E3/67A MANUFACTURING INFO
|
EGF1T-E3/67A PACKAGING INFO
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EGF1T-E3/67A ECAD MODELS
|
EGF1T-E3/67A APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| China |
|
PARAMETRIC INFO
|
| Type |
Switching Diode |
| Configuration |
Single |
| Peak Reverse Repetitive Voltage (V) |
1300 |
| Maximum DC Reverse Voltage (V) |
1300 |
| Maximum Continuous Forward Current (A) |
1 |
| Average Rectified Forward Current (A) |
1 |
| Typical Junction Capacitance (pF) |
8 |
| Speed |
Ultra Fast Recovery Rectifier |
| Maximum Junction Ambient Thermal Resistance |
50°C/W(Typ) |
| Peak Forward Voltage (V) |
3 |
| Maximum RMS Reverse Voltage (V) |
910 |
| Peak Non-Repetitive Surge Current (A) |
20 |
| Peak Reverse Current (uA) |
5 |
| Peak Reverse Recovery Time (ns) |
75(Typ) |
| Operating Junction Temperature (°C) |
-55 to 150 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Supplier Temperature Grade |
Commercial |
| Tradename |
SUPERECTIFIER® |
|
|
PACKAGE INFO
|
| Supplier Package |
DO-214BA |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.75(Max) |
| Package Width (mm) |
2.9(Max) |
| Package Height (mm) |
2.74(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
3(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.104 |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO |
| Jedec |
DO-214BA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
67A |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
14.4(Max) |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
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APPLICATIONS
|
• For use in high voltage rectification of photoflash
application.
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|
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