EMK325ABJ107MM-P TAIYO YUDEN CAP CER 100UF 16V X5R 1210

label:
2024/08/15 242
EMK325ABJ107MM-P TAIYO YUDEN 	CAP CER 100UF 16V X5R 1210


• Item Summary 100uF±20%, 16V, X5R, 1210/3225 (EIA/JIS)
• Lifecycle Stage Mass Production (Preferred)
• Standard packaging quantity (minimum)Taping Embossed 1000pcs


CATALOG
EMK325ABJ107MM-P COUNTRY OF ORIGIN
EMK325ABJ107MM-P PARAMETRIC INFO
EMK325ABJ107MM-P PACKAGE INFO
EMK325ABJ107MM-P MANUFACTURING INFO
EMK325ABJ107MM-P PACKAGING INFO


COUNTRY OF ORIGIN
Malaysia
China
Japan


PARAMETRIC INFO
Capacitance Value 100uF
Voltage 16VDC
Tolerance 20%
Dielectric X5R
Technology Standard
Maximum Operating Temperature (°C) 85
Case Style Ceramic Chip
Construction Flat
Microwave Application No
Operating Temperature (°C) -55 to 85
Minimum Operating Temperature (°C) -55
DC Rated Voltage (VDC) 16
Negative Capacitance Tolerance (%) -20
Positive Capacitance Tolerance (%) 20
Maximum Storage Temperature (°C) 30
Maximum Dissipation Factor (%) 10
Polarity Non Polar
Special Features High Dielectric
Test Frequency (Hz) 120
Fixed/Variable Fixed


PACKAGE INFO
Package/Case 1210
Mounting Surface Mount
Termination Style Pad
Terminal Pitch (mm) N/R
Product Length (mm) 3.2
Product Depth (mm) 2.5
Product Height (mm) 2.5
Product Diameter (mm) N/R
Seated Plane Height (mm) N/R
Product Weight (g) N/A
Length Tolerance (mm) ±0.3
Depth Tolerance (mm) ±0.3
Height Tolerance (mm) ±0.3
Diameter Tolerance (mm) N/R
Number of Terminals 2
Size (mm) 3.2 X 2.5 X 2.5
Maximum Product Length (mm) 3.5
Maximum Product Depth (mm) 2.8
Maximum Product Height (mm) 2.8


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Number of Reflow Cycle 2
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn
Under Plating Material Ni
Terminal Base Material Cu
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 7
Reel Width (mm) 10
Tape Pitch (mm) 4
Tape Width (mm) 8
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Packaging Document Link to Datasheet
Tape Type Embossed

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