EP1C12F324I7N Altera IC FPGA 249 I/O 324FBGA

label:
2024/03/15 248



CATALOG
EP1C12F324I7N COUNTRY OF ORIGIN
EP1C12F324I7N LIFE CYCLE
EP1C12F324I7N PARAMETRIC INFO
EP1C12F324I7N PACKAGE INFO
EP1C12F324I7N MANUFACTURING INFO
EP1C12F324I7N EACD MODELS


COUNTRY OF ORIGIN
Korea (Republic of)
Philippines


LIFE CYCLE
Obsolete Mar 29, 2019
PARAMETRIC INFO
Device Logic Units 12060
Device Logic Cells 12060
Maximum Number of User I/Os 249
Number of I/O Banks 4
Device Number of DLLs/PLLs 2
Maximum LVDS Data Rate (Mbps) 640
Tradename Cyclone
Maximum I/O Performance 640Mbps
RAM Bits (Kbit) 234
Total Number of Block RAM 52
Program Memory Type SRAM
Series name Cyclone®
Process Technology 130nm
Speed Grade 7
Differential I/O Standards Supported LVDS|PCI
Single-Ended I/O Standards Supported LVTTL|LVCMOS|SSTL-2|SSTL-3
External Memory Interface DDR SDRAM|FCRAM
Copy Protection yes
Shift Registers Utilize Memory
Supported IP Core Video LVDS SerDes Transmitter / Receiver|RLDRAM II Controller Core|IFI Advanced CAN IP
Programmability no
Supported IP Core Manufacture Microtronix Inc/CAST, Inc/Northwest Logic, Inc/IFI
In-System Programmability yes
Reprogrammability Support no
Maximum Internal Frequency (MHz) 320.1
Number of Global Clocks 8
Maximum Operating Supply Voltage (V) 1.575
I/O Voltage (V) 1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag June
Supplier Temperature Rating Industrial
Digital Control Impedance no
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Tolerant Configuration Interface Voltage (V) 1.5|1.8|2.5|3.3


PACKAGE INFO
Supplier packaging FBGA
Basic package type Ball Grid Array
Number of pins 324
Pin shape Ball
PCB 324
ears N/R
Pin spacing (mm) 1
Package length (mm) 19
Package width (mm) 19
Package height (mm) 1.8(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 19
Package Overall Width (mm) 19
Package Overall Height (mm) 2.2(Max)
Mounting surface height (mm) 2.2(Max)
Install Surface Mount
Packaging materials Plastic
package instruction Fine Pitch Ball Grid Array
Package series name BGA
JEDEC MS-034AAG-1
Package outline Link to datasheet


MANUFACTURING INFO
MSL 3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard IPC-1752
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) SnAgCu
Plating materials not applicable
Terminal Base Material not applicable
 
ECAD MODELS

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