EP1C3T100C8N Altera IC FPGA 65 I/O 100TQFP

label:
2024/03/13 249


CATALOG
EP1C3T100C8N COUNTRY OF ORIGIN
EP1C3T100C8N LIFE CYCLE
EP1C3T100C8N PARAMETRIC INFO
EP1C3T100C8N PACKAGE INFO
EP1C3T100C8N MANUFACTURING INFO
EP1C3T100C8N EACD MODELS


COUNTRY OF ORIGIN
Malaysia
China
Thailand


LIFE CYCLE
Obsolete Mar 29, 2019
PARAMETRIC INFO
Device Logic Units 2910
Device Logic Cells 2910
Maximum Number of User I/Os 65
Number of I/O Banks 4
Device Number of DLLs/PLLs 1
Maximum LVDS Data Rate (Mbps) 640
Tradename Cyclone
Maximum I/O Performance 640Mbps
RAM Bits (Kbit) 58.5
Total Number of Block RAM 13
Program Memory Type SRAM
Series name Cyclone®
Process Technology 130nm
Speed Grade 8
Differential I/O Standards Supported LVDS|PCI
Single-Ended I/O Standards Supported LVTTL|LVCMOS|SSTL-2|SSTL-3
External Memory Interface DDR SDRAM|FCRAM
Copy Protection yes
Shift Registers Utilize Memory
Supported IP Core Video LVDS SerDes Transmitter / Receiver|RLDRAM II Controller Core|IFI Advanced CAN IP
Programmability no
Supported IP Core Manufacture Microtronix Inc/CAST, Inc/Northwest Logic, Inc/IFI
In-System Programmability yes
Reprogrammability Support no
Maximum Internal Frequency (MHz) 275.03
Number of Global Clocks 8
Maximum Operating Supply Voltage (V) 1.575
I/O Voltage (V) 1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Temperature Flag June
Supplier Temperature Rating Commercial
Digital Control Impedance no
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Tolerant Configuration Interface Voltage (V) 1.5|1.8|2.5|3.3


PACKAGE INFO
Supplier packaging TQFP
Basic package type Lead-Frame SMT
Number of pins 100
Pin shape Gull-wing
PCB 100
ears N/R
Pin spacing (mm) 0.5
Package length (mm) 14
Package width (mm) 14
Package height (mm) 1
Package diameter (mm) N/R
Package Overall Length (mm) 16
Package Overall Width (mm) 16
Package Overall Height (mm) 1.2(Max)
Mounting surface height (mm) 1.2(Max)
Install Surface Mount
Packaging materials Plastic
package instruction Thin Quad Flat Package
Package series name QFP
JEDEC MS-026AED
Package outline Link to datasheet


MANUFACTURING INFO
MSL 3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard not applicable
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


ECAD MODELS

Продукт RFQ