EP2S60F1020C4N Altera IC FPGA 718 I/O 1020FBGA

label:
2024/04/16 287


CATALOG
EP2S60F1020C4N COUNTRY OF ORIGIN
EP2S60F1020C4N LIFE CYCLE
EP2S60F1020C4N PARAMETRIC INFO
EP2S60F1020C4N PACKAGE INFO
EP2S60F1020C4N MANUFACTURING INFO
EP2S60F1020C4N EACD MODELS


COUNTRY OF ORIGIN
Indonesia
Thailand
China
Korea (Republic of)
Taiwan (Province of China)
Malaysia
LIFE CYCLE
Obsolete Jun 04,2021
PARAMETRIC INFO
Device Logic Units 60440
Device Logic Cells 60440
Maximum Number of User I/Os 718
Number of I/O Banks 8
Device Number of DLLs/PLLs 12
Number of Multipliers 144 (18x18)
Number of Regional Clocks 32
Tradename Stratix
Maximum I/O Performance 1Gbps
RAM Bits (Kbit) 2484.6
Total Number of Block RAM 2+255+329
Program Memory Type SRAM
Series name Stratix® II
Process Technology 90nm
Speed Grade 4
Dedicated DSP 36
Differential I/O Standards Supported LVPECL|LVDS
Single-Ended I/O Standards Supported LVTTL|CMOS|SSTL|HSTL
Giga Multiply Accumulates per Second 37.8
External Memory Interface DDR SDRAM|DDR2 SDRAM|RLDRAM II|QDRII+SRAM
Mega Multiply Accumulates per second 37800
Copy Protection no
Shift Registers Utilize Memory
Supported IP Core Viterbi Compiler, High-Speed Parallel Decoder|RapidIO to AXI Bridge Controller (RAB)|PowerPC/SH/1960 System Controller|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz
Programmability no
Supported IP Core Manufacture Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc/PLDA
In-System Programmability yes
Reprogrammability Support no
Maximum Internal Frequency (MHz) 711.24
Number of Global Clocks 16
Maximum Operating Supply Voltage (V) 1.25
I/O Voltage (V) 1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Temperature Flag June
Supplier Temperature Rating Commercial
Digital Control Impedance no
Minimum Operating Supply Voltage (V) 1.15
Typical Operating Supply Voltage (V) 1.2
Tolerant Configuration Interface Voltage (V) 1.5|1.8|2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging FC-FBGA
Basic package type Ball Grid Array
Number of pins 1020
Pin shape Ball
PCB 1020
ears N/R
Pin spacing (mm) 1
Package length (mm) 33
Package width (mm) 33
Package height (mm) 3(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 33
Package Overall Width (mm) 33
Package Overall Height (mm) 3.5(Max)
Mounting surface height (mm) 3.5(Max)
Install Surface Mount
Packaging materials Plastic
package instruction Flip Chip Fine Pitch Ball Grid Array
Package series name BGA
JEDEC not applicable


MANUFACTURING INFO
MSL 3
Maximum reflow temperature (°C) 245
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard IPC-1752
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) SnAgCu
Plating materials not applicable
Terminal Base Material not applicable


ECAD MODELS


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