EP3C16F484C8N Altera IC FPGA 346 I/O 484FBGA

label:
2024/04/26 344


CATALOG
EP3C16F484C8N COUNTRY OF ORIGIN
EP3C16F484C8N PARAMETRIC INFO
EP3C16F484C8N PACKAGE INFO
EP3C16F484C8N MANUFACTURING INFO
EP3C16F484C8N PACKAGING INFO
EP3C16F484C8N EACD MODELS


 
COUNTRY OF ORIGIN
Taiwan (Province of China)
Korea (Republic of)
Malaysia
Philippines


 
PARAMETRIC INFO
Device Logic Units 15408
Device Logic Cells 15408
Maximum Number of User I/Os 346
Number of I/O Banks 8
Device Number of DLLs/PLLs 4
Number of Multipliers 56 (18x18)
Maximum LVDS Data Rate (Mbps) 875
Tradename Cyclone
RAM Bits (Kbit) 504
Total Number of Block RAM 56
Program Memory Type SRAM
Family Name Cyclone® III
Process Technology 65nm
Speed Grade 8
Differential I/O Standards Supported LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS
Single-Ended I/O Standards Supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
JTAG Support (-) Yes
External Memory Interface DDR2 SDRAM|QDRII+SRAM
Copy Protection Yes
Supported IP Core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC| 32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz
Programmability No
Supported IP Core Manufacture Altera/Freescale/CAST, Inc/MorethanIP/PLDA
In-System Programmability No
Number of Look-up Table Input 4
Reprogrammability Support No
Maximum Internal Frequency (MHz) 402
Number of Global Clocks 20
Maximum Operating Supply Voltage (V) 1.25
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Temperature Flag Jun
Supplier Temperature Grade Commercial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 1.15
Typical Operating Supply Voltage (V) 1.2
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


 
PACKAGE INFO
Supplier Package FBGA
Basic Package Type Ball Grid Array
Pin Count 484
Lead Shape Ball
PCB 484
Tab N/R
Pin Pitch (mm) 1
Package Length (mm) 23
Package Width (mm) 23
Package Height (mm) 1.75
Package Diameter (mm) N/R
Package Overall Length (mm) 23
Package Overall Width (mm) 23
Package Overall Height (mm) 2.25
Seated Plane Height (mm) 2.25
Mounting Surface Mount
Package Weight (g) 2.3
Package Material Plastic
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Jedec MS-034AAJ-1
Package Outline Link to Datasheet


 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R


 
PACKAGING INFO
Packaging Tray
Quantity Of Packaging 60
Packaging Document Link to Datasheet


 
ECAD MODELS




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