EP3C25E144C8N Intel / Altera IC FPGA 82 I/O 144EQFP

label:

2024/03/11 298

Cyclone III device family offers the following features:

■ Lowest power consumption with TSMC low-power process technology andAltera® power-aware design flow

■ Low-power operation offers the following benefits:
■ Extended battery life for portable and handheld applications
■ Reduced or eliminated cooling system costs
■ Operation in thermally-challenged environments

■ Hot-socketing operation support

Cyclone III LS devices offer the following design security features:

■ Configuration security using advanced encryption standard (AES) with 256-bitvolatile key

■ Routing architecture optimized for design separation flow with the Quartus® IIsoftware
■ Design separation flow achieves both physical and functional isolationbetween design partitions

■ Ability to disable external JTAG port

■ Error Detection (ED) Cycle Indicator to core
■ Provides a pass or fail indicator at every ED cycle
■ Provides visibility over intentional or unintentional change of configurationrandom access memory (CRAM) bits

■ Ability to perform zeroization to clear contents of the FPGA logic, CRAM,embedded memory, and AES key

■ Internal oscillator enables system monitor and health check capabilities

■ High memory-to-logic and multiplier-to-logic ratio

■ High I/O count, low-and mid-range density devices for user I/O constrainedapplications
■ Adjustable I/O slew rates to improve signal integrity
■ Supports I/O standards such as LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X,LVPECL, bus LVDS (BLVDS), LVDS, mini-LVDS, RSDS, and PPDS
■ Supports the multi-value on-chip termination (OCT) calibration feature toeliminate variations over process, voltage, and temperature (PVT)

■ Four phase-locked loops (PLLs) per device provide robust clock management andsynthesis for device clock management, external system clock management, andI/O interfaces
■ Five outputs per PLL
■ Cascadable to save I/Os, ease PCB routing, and reduce jitter
■ Dynamically reconfigurable to change phase shift, frequency multiplication ordivision, or both, and input frequency in the system without reconfiguring thedevice

■ Remote system upgrade without the aid of an external controller

■ Dedicated cyclical redundancy code checker circuitry to detect single-event upset(SEU) issues

■ Nios® II embedded processor for Cyclone III device family, offering low cost andcustom-fit embedded processing solutions

■ Wide collection of pre-built and verified IP cores from Altera and AlteraMegafunction Partners Program (AMPP) partners

■ Supports high-speed external memory interfaces such as DDR, DDR2,SDR SDRAM, and QDRII SRAM
■ Auto-calibrating PHY feature eases the timing closure process and eliminatesvariations with PVT for DDR, DDR2, and QDRII SRAM interfaces

CATALOG

EP3C25E144C8N COUNTRY OF ORIGIN

EP3C25E144C8N PARAMETRIC INFO

EP3C25E144C8N PACKAGE INFO

EP3C25E144C8N MANUFACTURING INFO

EP3C25E144C8N PACKAGING INFO

COUNTRY OF ORIGIN

Philippines

Malaysia

PARAMETRIC INFO

Device Logic Units	24624
Device Logic Cells	24624
Maximum Number of User I/Os	82
Number of I/O Banks	8
Device Number of DLLs/PLLs	4
Number of Multipliers	66 (18x18)
Maximum LVDS Data Rate (Mbps)	875
Tradename	Cyclone
RAM Bits (Kbit)	594
Total Number of Block RAM	66
Program Memory Type	SRAM
Family Name	Cyclone® III
Process Technology	65nm
Speed Grade	8
Differential I/O Standards Supported	LVPECL\|LVDS\|HSTL-18\|HSTL-15\|HSTL-12\|SSTL-2\|SSTL-18\|RSDS
Single-Ended I/O Standards Supported	LVTTL\|LVCMOS\|PCI\|PCI-X\|SSTL\|HSTL
JTAG Support (-)	Yes
External Memory Interface	DDR2 SDRAM\|QDRII+SRAM
Copy Protection	Yes
Supported IP Core	Viterbi Compiler, Low-Speed/Hybrid Serial Decoder\|V1 ColdFire\|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)\|10 Gigabit Ethernet MAC\| 32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz
Programmability	No
Supported IP Core Manufacture	Altera/Freescale/CAST, Inc/MorethanIP/PLDA
In-System Programmability	No
Number of Look-up Table Input	4
Reprogrammability Support	No
Maximum Internal Frequency (MHz)	402
Number of Global Clocks	20
Maximum Operating Supply Voltage (V)	1.25
I/O Voltage (V)	1.2\|1.5\|1.8\|2.5\|3.3
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	85
Temperature Flag	Jun
Supplier Temperature Grade	Commercial
Digital Control Impedance	No
Minimum Operating Supply Voltage (V)	1.15
Typical Operating Supply Voltage (V)	1.2
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	EQFP EP
Basic Package Type	Lead-Frame SMT
Pin Count	144
Lead Shape	Gull-wing
PCB	144
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	20
Package Width (mm)	20
Package Height (mm)	1.45
Package Diameter (mm)	N/R
Package Overall Length (mm)	22
Package Overall Width (mm)	22
Package Overall Height (mm)	1.55
Seated Plane Height (mm)	1.55
Mounting	Surface Mount
Package Weight (g)	1.3
Package Material	Plastic
Package Description	Plastic Enhanced Quad Flat Package, Exposed Pad
Package Family Name	QFP
Jedec	MS-026-BFB-HD

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging	Tray
Quantity Of Packaging	60
Packaging Document	Link to Datasheet