EP4CGX110CF23I7N Intel / Altera C FPGA 270 I/O 484FBGA

label:
2023/08/25 478

 
• Low-cost, low-power FPGA fabric:
   • 6K to 150K logic elements
   • Up to 6.3 Mb of embedded memory
   • Up to 360 18 × 18 multipliers for DSP processing intensive applications
   • Protocol bridging applications for under 1.5 W total power
• Cyclone IV GX devices offer up to eight high-speed transceivers that provide:
   • Data rates up to 3.125 Gbps
   • 8B/10B encoder/decoder
   • 8-bit or 10-bit physical media attachment (PMA) to physical coding sublayer (PCS) interface
   • Byte serializer/deserializer (SERDES)
   • Word aligner
   • Rate matching FIFO
   • TX bit slipper for Common Public Radio Interface (CPRI)
   • Electrical idle
   • Dynamic channel reconfiguration allowing you to change data rates and protocols on-the-fly
   • Static equalization and pre-emphasis for superior signal integrity
   • 150 mW per channel power consumption
   • Flexible clocking structure to support multiple protocols in a single transceiver block
• Cyclone IV GX devices offer dedicated hard IP for PCI Express (PIPE) (PCIe) Gen 1:
   • ×1, ×2, and ×4 lane configurations
   • End-point and root-port configurations
   • Up to 256-byte payload
   • One virtual channel
   • 2 KB retry buffer
   • 4 KB receiver (Rx) buffer
• Cyclone IV GX devices offer a wide range of protocol support:
   • PCIe (PIPE) Gen 1 ×1, ×2, and ×4 (2.5 Gbps)
   • Gigabit Ethernet (1.25 Gbps)
   • CPRI (up to 3.072 Gbps)
   • XAUI (3.125 Gbps)
   • Triple rate serial digital interface (SDI) (up to 2.97 Gbps)
   • Serial RapidIO (3.125 Gbps)
   • Basic mode (up to 3.125 Gbps)
   • V-by-One (up to 3.0 Gbps)
   • DisplayPort (2.7 Gbps)
   • Serial Advanced Technology Attachment (SATA) (up to 3.0 Gbps)
   • OBSAI (up to 3.072 Gbps)
• Up to 532 user I/Os
   • LVDS interfaces up to 840 Mbps transmitter (Tx), 875 Mbps Rx
   • Support for DDR2 SDRAM interfaces up to 200 MHz
   • Support for QDRII SRAM and DDR SDRAM up to 167 MHz  
• Up to eight phase-locked loops (PLLs) per device
• Offered in commercial and industrial temperature grades

 
CATALOG
EP4CGX110CF23I7N COUNTRY OF ORIGIN
EP4CGX110CF23I7N PARAMETRIC INFO
EP4CGX110CF23I7N PACKAGE INFO
EP4CGX110CF23I7N MANUFACTURING INFO


COUNTRY OF ORIGIN
Korea (Republic of)

 
PARAMETRIC INFO
Device Logic Units 109424
Device Logic Cells 109424
Maximum Number of User I/Os 270
Number of I/O Banks 11
Device Number of DLLs/PLLs 4
Number of Multipliers 280 (18x18)
Maximum LVDS Data Rate (Mbps) 875
Tradename Cyclone
RAM Bits (Kbit) 5490
Total Number of Block RAM 610
Program Memory Type SRAM
Family Name Cyclone® IV GX
Process Technology 60nm
Speed Grade 7
Transceiver Blocks 8
Transceiver Speed (Gbps) 3.125
Differential I/O Standards Supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL
Single-Ended I/O Standards Supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
External Memory Interface DDR2 SDRAM|QDRII+SRAM
PCI Blocks 1
Copy Protection No
Supported IP Core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter
Programmability Yes
Supported IP Core Manufacture Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc
In-System Programmability No
Reprogrammability Support No
Number of Global Clocks 30
Maximum Operating Supply Voltage (V) 1.24
I/O Voltage (V) 1.2|1.5|1.8|2.5|3|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 1.16
Typical Operating Supply Voltage (V) 1.2
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 

PACKAGE INFO
Supplier Package FBGA
Basic Package Type Ball Grid Array
Pin Count 484
Lead Shape Ball
PCB 484
Tab N/R
Pin Pitch (mm) 1
Package Length (mm) 23
Package Width (mm) 23
Package Height (mm) 1.75
Package Diameter (mm) N/R
Package Overall Length (mm) 23
Package Overall Width (mm) 23
Package Overall Height (mm) 2.25
Seated Plane Height (mm) 2.25
Mounting Surface Mount
Package Material Plastic
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Jedec MS-034AAJ-1
Package Outline Link to Datasheet

      
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 250
Reflow Solder Time (Sec) 30
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R
 

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