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• Serial or quad-serial FPGA configuration in devices that support active serial (AS)x1 or AS x4 configuration schemes(2)
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• Low cost, low pin count, and non-volatile memory
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• 2.7-V to 3.6-V operation
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• Available in 8- or 16- small-outline integrated circuit (SOIC) package
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• Reprogrammable memory with up to 100,000 erase or program cycles
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• Write protection support for memory sectors using status register bits
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• Fast read, extended dual input fast read, and extended quad input fast read of the entire memory using a single operation code
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• Write bytes, extended dual input fast write bytes, and extended quad input fast write bytes of the entire memory using a single operation code
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CATALOG
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EPCQ32SI8N COUNTRY OF ORIGIN
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EPCQ32SI8N LIFE CYCLE
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EPCQ32SI8N PARAMETRIC INFO
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EPCQ32SI8N PACKAGE INFO
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EPCQ32SI8N MANUFACTURING INFO
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EPCQ32SI8N PACKAGING INFO
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COUNTRY OF ORIGIN
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China
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Indonesia
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Malaysia
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Taiwan (Province of China)
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Thailand
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EPCQ32SI8N LIFE CYCLE
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Obsolete Feb 22,2018
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PARAMETRIC INFO
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| Memory Type |
Flash |
| Memory Size (bit) |
32M |
| Programmable Type |
ISP |
| Reprogrammability |
yes |
| Interface Type |
Quad Serial|Serial |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Supplier temperature level |
Industrial |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Cycle Time (s) |
8m |
| Minimum Operating Temperature (°C) |
-40 |
| I/O Mode |
Serial |
| Maximum Operating Temperature (°C) |
85 |
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PACKAGE INFO
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| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| TAB |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.65(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.9 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| JEDEC |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 |
| Number of reflux cycles |
3 |
| Reflow Temperature Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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