EPM240T100C5N Altera IC CPLD 192MC 4.7NS 100TQFP

label:
2024/07/4 197


CATALOG
EPM240T100C5N COUNTRY OF ORIGIN
EPM240T100C5N PARAMETRIC INFO
EPM240T100C5N PACKAGE INFO
EPM240T100C5N MANUFACTURING INFO
EPM240T100C5N PACKAGING INFO
EPM240T100C5N EACD MODELS



COUNTRY OF ORIGIN
Philippines
Malaysia
Korea (Republic of)
Taiwan (Province of China)



PARAMETRIC INFO
Device Logic Cells 240
Number of User I/Os 80
Number of Logic Blocks/Elements 24
Number of Macro Cells 192
Number of I/O Banks 2
Number of Inter Dielectric Layers 6
Tradename MAX
Copy Protection Yes
Number of Global Clocks 4
Memory Size (Kbit) 8
Program Memory Type Flash
Family Name MAX® II
Process Technology 0.18um
Speed Grade 5
Data Gate No
Individual Output Enable Control Yes
Programmability Yes
In-System Programmability Yes
Reprogrammability Support No
Maximum Operating Frequency (MHz) 201.1
Maximum Clock to Output Delay (ns) 6.9
Maximum Propagation Delay Time (ns) 7.5|5.9
Tolerant Configuration Interface Voltage (V) 1.8|2.5|3.3|5
I/O Voltage (V) 1.5|1.8|2.5|3.3
Minimum Operating Supply Voltage (V) 2.375
Typical Operating Supply Voltage (V) 2.5|3.3
Programmable Type In System Programmable
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Temperature Flag Jun
Supplier Temperature Grade Commercial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150



PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 100
Lead Shape Gull-wing
PCB 100
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 14
Package Width (mm) 14
Package Height (mm) 1
Package Diameter (mm) N/R
Package Overall Length (mm) 16
Package Overall Width (mm) 16
Package Overall Height (mm) 1.1
Seated Plane Height (mm) 1.1
Mounting Surface Mount
Package Weight (g) 0.51
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Jedec MS-026AED
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Tray
Quantity Of Packaging 90
Packaging Document Link to Datasheet



ECAD MODELS


Продукт RFQ