ERA-3SM+ Mini-Circuits IC RF AMP CELLULAR 0HZ-3GHZ 4SMD

label:
2025/10/9 17
ERA-3SM+ Mini-Circuits IC RF AMP CELLULAR 0HZ-3GHZ 4SMD


• DC to 3 GHz
• Single Voltage Supply
• Internally Matched to 50 Ohms
• Unconditionally Stable
• Low Performance Variation Over Temperature
• Transient Protected


CATALOG
ERA-3SM+ COUNTRY OF ORIGIN
ERA-3SM+ PARAMETRIC INFO
ERA-3SM+ PACKAGE INFO
ERA-3SM+ MANUFACTURING INFO
ERA-3SM+ PACKAGING INFO
ERA-3SM+ ECAD MODELS
ERA-3SM+ APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Malaysia


PARAMETRIC INFO
Manufacturer Type Monolithic Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 16.4@3000MHz
Typical Noise Figure (dB) 2.9@3000MHz
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 10.5
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 24
Typical Output Intercept Point (dBm) 24@3000MHz
Maximum Reverse Isolation (dB) 24(Typ)@2000MHz
Maximum Power Dissipation (mW) 330
Maximum Operating Frequency (MHz) 3000
Typical Output Power (dBm) 10.5@3000MHz
Typical Output Power Range (dBm) 10 to 15
Maximum Input Return Loss (dB) 18(Typ)@3000MHz
Maximum Output Return Loss (dB) 17(Typ)@3000MHz
Power Supply Type Single
Minimum Single Supply Voltage (V) 3
Typical Single Supply Voltage (V) 3.2
Maximum Single Supply Voltage (V) 3.4
Maximum Operating Supply Voltage (V) 3.4
Maximum Supply Current (mA) 35(Typ)
Minimum Operating Temperature (°C) -45
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 

PACKAGE INFO
Supplier Package Case WW-107
Basic Package Type Lead-Frame SMT
Pin Count 4
Lead Shape Gull-wing
PCB 4
Tab N/R
Pin Pitch (mm) N/R
Package Length (mm) N/R
Package Width (mm) N/R
Package Height (mm) 1.52 - 0.51(Max)
Package Diameter (mm) 2.16
Seated Plane Height (mm) 1.52
Mounting Surface Mount
Terminal Width (mm) 0.51
Package Weight (g) 0.015
Package Material Plastic
Package Description N/A
Package Family Name N/A
Jedec N/A
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) N/A
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R

PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 7
Reel Diameter (in) 7|13
Tape Pitch (mm) 8
Tape Width (mm) 12
Packaging Document Link to Datasheet
 
ECAD MODELS


APPLICATIONS
• Cellular/ PCS/ 3G Base Station
• CATV, Cable Modem & DBS
• Fixed Wireless & WLAN
• Microwave Radio & Test Equipment
Продукт RFQ