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■ Low profile package
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■ Ideal for automated placement
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■ Glass passivated pellet chip junction
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■ Ultrafast recovery times for high efficiency
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■ Low forward voltage, low power losses
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■ High forward surge capability
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■ Meets MSL level 1, per J-STD-020,
LF maximum peak of 260 °C
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■ AEC-Q101 qualified available
- Automotive ordering code: P/NHE3 or P/NHM3
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■ Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
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| CATALOG |
| ES1C-E3/61T COUNTRY OF ORIGIN |
ES1C-E3/61T PARAMETRIC INFO
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ES1C-E3/61T PACKAGE INFO
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ES1C-E3/61T MANUFACTURING INFO
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| ES1C-E3/61T PACKAGING INFO
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ES1C-E3/61T ECAD MODELS
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COUNTRY OF ORIGIN
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| Taiwan (Province of China) |
China
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PARAMETRIC INFO
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| Type |
Switching Diode |
| Configuration |
Single |
| Peak Reverse Repetitive Voltage (V) |
150 |
| Maximum DC Reverse Voltage (V) |
150 |
| Maximum Continuous Forward Current (A) |
1 |
| Average Rectified Forward Current (A) |
1 |
| Typical Junction Capacitance (pF) |
10 |
| Typical Reverse Recovery Charge (nC) |
10(Max) |
| Speed |
Ultra Fast Recovery Rectifier |
| Maximum Junction Ambient Thermal Resistance |
85°C/W(Typ) |
| Peak Forward Voltage (V) |
0.92 |
| Maximum RMS Reverse Voltage (V) |
105 |
| Peak Non-Repetitive Surge Current (A) |
30 |
| Peak Reverse Current (uA) |
5 |
| Peak Reverse Recovery Time (ns) |
15 |
| Operating Junction Temperature (°C) |
-55 to 150 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Supplier Temperature Grade |
Commercial |
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PACKAGE INFO
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| Supplier Package |
SMA |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.5(Max) |
| Package Width (mm) |
2.79(Max) |
| Package Height (mm) |
2.09(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2.29(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO-214-AC |
| Jedec |
DO-214AC |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Maximum Wave Temperature (°C) |
270 |
| Wave Solder Time (Sec) |
7 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
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PACKAGING INFO
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ECAD MODELS
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