 |
| |
• ESD / transient protection according to:
- IEC61000-4-2 (ESD): ±25 kV (air) / ±25 kV (contact)
- IEC61000-4-4 (EFT): ±2.5 kV / ±50 A (5/50 ns)
- IEC61000-4-5 (Surge): ±2.5 A (8/20 μs) |
| • Bi-directional maximum working voltage: VWM = ±5.5 V |
| • Line capacitance: CL
= 0.28 pF at f = 1 MHz |
| • Clamping voltage: Vcl = 20 V at ITLP = 16 A with Rdyn = 0.78 Ω |
| • Very low leakage current: IL
=0.1 nA |
| • Small form factor SMD size 0201, low profile (0.58 x 0.28 x 0.15 mm³) |
| |
| CATALOG |
| ESD108B1CSP0201XTSA1 COUNTRY OF ORIGIN |
| ESD108B1CSP0201XTSA1 PARAMETRIC INFO |
| ESD108B1CSP0201XTSA1 PACKAGE INFO |
| ESD108B1CSP0201XTSA1 MANUFACTURING INFO |
| ESD108B1CSP0201XTSA1 PACKAGING INFO |
| ESD108B1CSP0201XTSA1 ECAD MODELS |
| ESD108B1CSP0201XTSA1 APPLICATIONS |
| |
| COUNTRY OF ORIGIN |
| Germany |
| Malaysia |
| |
| PARAMETRIC INFO |
| Type |
TVS |
| Direction Type |
Bi-Directional |
| Maximum Working Voltage (V) |
5.5 |
| Configuration |
Single |
| Capacitance Value (pF) |
0.38 |
| Maximum Clamping Voltage (V) |
41 |
| Maximum Leakage Current (uA) |
0.02 |
| Number of Elements per Chip |
1 |
| Peak Pulse Power Dissipation (W) |
27.5 |
| Maximum Peak Pulse Current (A) |
2.5 |
| Typical Trigger Voltage (V) |
9.5 |
| Minimum Operating Temperature (°C) |
-55 |
| Fail Safe Protection |
No |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
WLL |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
No Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.36 |
| Package Length (mm) |
0.58 |
| Package Width (mm) |
0.28 |
| Package Height (mm) |
0.15 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/A |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
N/A |
| Package Family Name |
WLL |
| Jedec |
N/A |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd |
| Terminal Base Material |
NiP |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
15000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
2 |
| Tape Width (mm) |
8 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • USB 3.x Gen. 1, USB 2.0 |
| • HDMI, DisplayPort |
|
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