|
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• Low Clamping Voltage
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• Low Body Height: 0.028 (0.7 mm)
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• Stand−off Voltage: 2.5 V − 12 V
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• Peak Power up to 240 Watts @ 8 x 20 s Pulse
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• Low Leakage
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• Response Time is Typically < 1 ns
|
|
| CATALOG |
ESD5Z3.3T1G COUNTRY OF ORIGIN
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ESD5Z3.3T1G PARAMETRIC INFO
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ESD5Z3.3T1G PACKAGE INFO
|
ESD5Z3.3T1G MANUFACTURING INFO
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ESD5Z3.3T1G PACKAGING INFO
|
ESD5Z3.3T1G ECAD MODELS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
China
|
|
PARAMETRIC INFO
|
| Type |
TVS |
| Direction Type |
Uni-Directional |
| Maximum Working Voltage (V) |
3.3 |
| Maximum Power Dissipation (mW) |
500 |
| Configuration |
Single |
| Capacitance Value (pF) |
105(Typ) |
| Maximum Clamping Voltage (V) |
14.1 |
| Maximum Reverse Leakage Current (uA) |
0.05 |
| Number of Elements per Chip |
1 |
| Peak Pulse Power Dissipation (W) |
158 |
| Test Current (mA) |
1 |
| Maximum Response Time (ns) |
1(Typ) |
| Maximum Peak Pulse Current (A) |
11.2 |
| Minimum Breakdown Voltage (V) |
5 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOD-523 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
Flat |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
1.2 |
| Package Width (mm) |
0.8 |
| Package Height (mm) |
0.6 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
1.6 |
| Package Overall Width (mm) |
0.8 |
| Package Overall Height (mm) |
0.6 |
| Seated Plane Height (mm) |
0.6 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.3 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Diode Package |
| Package Family Name |
SOD |
| Jedec |
SOD-523 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi Alloy |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
|
| |
| ECAD MODELS |
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| |
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