  
       | 
    
    
       
       
       | 
    
    
      •    single line low capacitance Transil diode 
       | 
    
    
      •        bidirectional ESD protection 
       | 
    
    
      •         ESD protection > 30 kV (IEC 61000-4-2 contact
      discharge) 
       | 
    
    
      •       breakdown voltage VBR = 6.1 V min. 
       | 
    
    
      • low diode capacitance (22 pF typ. at 0 V) 
       | 
    
    
      | • low leakage current < 100 nA at 3 V
       | 
    
    
      | • very small PCB area 0.6 mm2 | 
    
    
      | • lead-free package  | 
    
    
       
       
       | 
    
    
      | CATALOG | 
    
    
      | ESDALC6V1-1BM2 LIFECYCLE | 
    
    
      ESDALC6V1-1BM2 PARAMETRIC INFO 
       | 
    
    
      ESDALC6V1-1BM2 PACKAGE INFO 
       | 
    
    
      ESDALC6V1-1BM2 MANUFACTURING INFO 
       | 
    
    
      ESDALC6V1-1BM2 PACKAGING INFO 
       | 
    
    
      ESDALC6V1-1BM2 APPLICATIONS 
       | 
    
    
       
       
       | 
    
    
      | LIFECYCLE | 
    
    
      Obsolete 
      Jun 29,2010 
       | 
    
    
        
       
       | 
    
    
      PARAMETRIC INFO 
       | 
    
    
      
      
        
          
            | Type | 
            TVS | 
           
          
            | Direction Type | 
            Bi-Directional | 
           
          
            | Maximum Working Voltage (V) | 
            3 | 
           
          
            | Configuration | 
            Single | 
           
          
            | Capacitance Value (pF) | 
            22(Typ) | 
           
          
            | Maximum Leakage Current (uA) | 
            0.1 | 
           
          
            | Number of Elements per Chip | 
            1 | 
           
          
            | Peak Pulse Power Dissipation (W) | 
            140 | 
           
          
            | Minimum Operating Temperature (°C) | 
            -40 | 
           
          
            | Maximum Operating Temperature (°C) | 
            125 | 
           
          
            | Minimum Storage Temperature (°C) | 
            -55 | 
           
          
            | Maximum Storage Temperature (°C) | 
            150 | 
           
        
       
       | 
    
    
       
       
       | 
    
    
      PACKAGE INFO 
       | 
    
    
      
      
        
          
            | Supplier Package | 
            SOD-882 | 
           
          
            | Basic Package Type | 
            Non-Lead-Frame SMT | 
           
          
            | Pin Count | 
            2 | 
           
          
            | Lead Shape | 
            No Lead | 
           
          
            | PCB | 
            2 | 
           
          
            | Tab | 
            N/R | 
           
          
            | Pin Pitch (mm) | 
            N/R | 
           
          
            | Package Length (mm) | 
            1 | 
           
          
            | Package Width (mm) | 
            0.6 | 
           
          
            | Package Height (mm) | 
            0.5(Max) | 
           
          
            | Package Diameter (mm) | 
            N/R | 
           
          
            | Seated Plane Height (mm) | 
            0.5 | 
           
          
            | Mounting | 
            Surface Mount | 
           
          
            | Package Material | 
            Plastic | 
           
          
            | Package Description | 
            Small Outline Diode Package | 
           
          
            | Package Family Name | 
            SOD | 
           
          
            | Package Outline | 
            Link to Datasheet | 
           
        
       
       | 
    
    
       
       
       | 
    
    
      MANUFACTURING INFO 
       | 
    
    
      
      
        
          
            | MSL | 
            1 | 
           
          
            | Maximum Reflow Temperature (°C) | 
            260 | 
           
          
            | Reflow Solder Time (Sec) | 
            30 | 
           
          
            | Number of Reflow Cycle | 
            3 | 
           
          
            | Reflow Temp. Source | 
            Link to Datasheet | 
           
          
            | Maximum Wave Temperature (°C) | 
            N/R | 
           
          
            | Wave Solder Time (Sec) | 
            N/R | 
           
          
            | Wave Temp. Source | 
            Link to Datasheet | 
           
          
            | Lead Finish(Plating) | 
            Au | 
           
          
            | Under Plating Material | 
            Pd over Ni | 
           
          
            | Terminal Base Material | 
            Cu Alloy | 
           
          
            | Shelf Life Period | 
            2 Years | 
           
        
       
       | 
    
    
       
       
       | 
    
    
      PACKAGING INFO 
       | 
    
    
      
      
        
          
            | Packaging | 
            Tape and Reel | 
           
          
            | Quantity Of Packaging | 
            3000 | 
           
          
            | Packaging Document | 
            Link to Datasheet | 
           
        
       
       | 
    
    
       
       
       | 
    
    
      APPLICATIONS 
       | 
    
    
      •              computers 
       | 
    
    
      | • printers
       | 
    
    
      •  communication systems 
       | 
    
    
      • cellular phone handsets and accessories 
       | 
    
    
      | • video equipment | 
    
    
       
       | 
    
    
      |   | 
    
    
      |   |