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• AEC-Q101 qualified
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• Asymetrical bidirectional ESD protection
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• Low leakage current (IR max. < 50 nA at VRM)
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• Stand-off voltage:– -15 V (to comply with reverse battery)– +24 V (to comply with jump start) |
• High ESD protection level: up to 30 kV |
• ECOPACK2 RoHS compliant component |
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CATALOG |
ESDLIN1524BJ COUNTRY OF ORIGIN |
ESDLIN1524BJ PARAMETRIC INFO
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ESDLIN1524BJ PACKAGE INFO
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ESDLIN1524BJ MANUFACTURING INFO
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ESDLIN1524BJ PACKAGING INFO
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ESDLIN1524BJ EACD MODELS
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COUNTRY OF ORIGIN |
China |
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PARAMETRIC INFO
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Type |
TVS |
Direction Type |
Bi-Directional |
Maximum Working Voltage (V) |
24 |
Configuration |
Single |
Capacitance Value (pF) |
20 |
Maximum Clamping Voltage (V) |
50 |
Maximum Leakage Current (uA) |
0.001 |
Number of Elements per Chip |
1 |
Peak Pulse Power Dissipation (W) |
160 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
175 |
Supplier Temperature Grade |
Automotive |
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PACKAGE INFO
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Supplier Package |
SOD-323 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
2 |
Lead Shape |
Gull-wing |
PCB |
2 |
Tab |
N/R |
Pin Pitch (mm) |
N/R |
Package Length (mm) |
1.8(Max) |
Package Width (mm) |
1.45(Max) |
Package Height (mm) |
1.07(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.17(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Small Outline Diode Package |
Package Family Name |
SOD |
Jedec |
SOD-323 |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Alloy 42 |
Shelf Life Period |
2 Years |
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PACKAGING INFO
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Packaging |
Tape and Reel |
Quantity Of Packaging |
100 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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