|
|
• RDS(ON) = 7.5 m (Typ.), VGS = 10 V, ID = 80 A
|
• Qg (tot) = 84 nC (Typ.), VGS = 10 V
|
• Low Miller Charge
|
• Low Qrr Body Diode
|
• UIS Capability (Single Pulse and Repetitive Pulse)
|
• These Devices are Pb−Free and are RoHS Compliant
|
|
| CATALOG |
FDB3632 COUNTRY OF ORIGIN
|
FDB3632 PARAMETRIC INFO
|
FDB3632 PACKAGE INFO
|
FDB3632 MANUFACTURING INFO
|
FDB3632 PACKAGING INFO
|
FDB3632 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
India
|
China
|
Philippines
|
|
PARAMETRIC INFO
|
| Channel Type |
N |
| Channel Mode |
Enhancement |
| Configuration |
Single |
| Maximum Drain Source Voltage (V) |
100 |
| Maximum Continuous Drain Current (A) |
12 |
| Maximum Absolute Continuous Drain Current (A) |
80 |
| Maximum Gate Source Voltage (V) |
±20 |
| Maximum Drain Source Resistance (mOhm) |
9@10V |
| Typical Gate Charge @ Vgs (nC) |
84@10V |
| Typical Gate Charge @ 10V (nC) |
84 |
| Maximum Power Dissipation (mW) |
310000 |
| Process Technology |
TMOS |
| Category |
Power MOSFET |
| Typical Input Capacitance @ Vds (pF) |
6000@25V |
| Typical Turn-On Delay Time (ns) |
30 |
| Typical Turn-Off Delay Time (ns) |
96 |
| Typical Fall Time (ns) |
46 |
| Typical Rise Time (ns) |
39 |
| Number of Elements per Chip |
1 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
175 |
|
|
PACKAGE INFO
|
| Supplier Package |
D2PAK |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
2 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
10.67(Max) |
| Package Width (mm) |
9.65(Max) |
| Package Height (mm) |
4.83(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.67(Max) |
| Package Overall Width (mm) |
15.88(Max) |
| Package Overall Height (mm) |
5.08(Max) |
| Seated Plane Height (mm) |
5.08(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Double Deca Watt Package |
| Package Family Name |
TO-263 |
| Jedec |
TO-263AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
800 |
| Packaging Document |
Link to Datasheet |
|
|
APPLICATIONS
|
• Synchronous Rectification
|
| • Battery Protection Circuit |
• Motor Drives and Uninterruptible Power Supplies
|
• Micro Solar Inverter
|
|
| |
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