FDD4243 onsemi / Fairchild MOSFET P-CH 40V 6.7A DPAK

label:
2023/11/21 313
• Max RDS(on) = 44 m at VGS = −10 V, ID = −6.7 A
• Max RDS(on) = 64 m at VGS = −4.5 V, ID = −5.5 A
• High Performance Trench Technology for Extremely Low rDS(on)  
• Pb−Free, Halide Free and RoHS Compliant


CATALOG
FDD4243 COUNTRY OF ORIGIN
FDD4243 PARAMETRIC INFO
FDD4243 PACKAGE INFO
FDD4243 MANUFACTURING INFO
FDD4243 PACKAGING INFO
FDD4243 ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 40
Material Si
Maximum Continuous Drain Current (A) 6.7
Maximum Absolute Continuous Drain Current (A) 24
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 44@10V
Typical Gate Charge @ Vgs (nC) 21@10V
Typical Gate Charge @ 10V (nC) 21
Maximum Power Dissipation (mW) 42000
Process Technology TMOS
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 1165@20V
Typical Turn-On Delay Time (ns) 6
Typical Turn-Off Delay Time (ns) 22
Typical Fall Time (ns) 7
Typical Rise Time (ns) 15
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 175
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package DPAK
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 2
Tab Tab
Pin Pitch (mm) 2.29
Package Length (mm) 6.73(Max)
Package Width (mm) 6.22(Max)
Package Height (mm) 2.39(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 6.73(Max)
Package Overall Width (mm) 10.41(Max)
Package Overall Height (mm) 2.52(Max)
Seated Plane Height (mm) 2.52(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Deca Watt Package
Package Family Name TO-252
Jedec TO-252AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuNiSn
 
PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 2500
 
ECAD MODELS

Продукт RFQ