FDMS86101 onsemi / Fairchild MOSFET N-CH 100V 12.4A POWER56

Channel Type	N
Channel Mode	Enhancement
Configuration	Single Quad Drain Triple Source
Maximum Drain Source Voltage (V)	100
Material	Si
Maximum Continuous Drain Current (A)	12.4
Maximum Gate Source Voltage (V)	±20
Maximum Drain Source Resistance (mOhm)	8@10V
Typical Gate Charge @ Vgs (nC)	39@10V\|22@5V
Typical Gate Charge @ 10V (nC)	39
Maximum Power Dissipation (mW)	2500
Process Technology	TMOS
Category	Power MOSFET
Typical Output Capacitance (pF)	460
Typical Input Capacitance @ Vds (pF)	2255@50V
Typical Turn-On Delay Time (ns)	15
Typical Turn-Off Delay Time (ns)	27
Typical Fall Time (ns)	7
Typical Rise Time (ns)	11
Number of Elements per Chip	1
Minimum Storage Temperature (°C)	-55
Maximum Storage Temperature (°C)	150
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	150

Supplier Package	PQFN EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	8
Lead Shape	No Lead
PCB	8
Tab	N/R
Pin Pitch (mm)	1.27
Package Length (mm)	5(Max)
Package Width (mm)	5.85(Max)
Package Height (mm)	1.05(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	5.1
Package Overall Width (mm)	6.15
Package Overall Height (mm)	1.1(Max)
Seated Plane Height (mm)	1.1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Plastic Quad Flat No Lead Package, Exposed Pad
Package Family Name	QFN
Jedec	MO-240AA
Package Outline	Link to Datasheet

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	IPC-1752
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy

• DC−DC Conversion