ГлавнаяБлогFDP20N50 onsemi / Fairchild MOSFET N-CH 500V 20A TO-220

FDP20N50 onsemi / Fairchild MOSFET N-CH 500V 20A TO-220

label:
2023/10/23 291
• Rps(an)=200 ms2 (Typ.)@VGs=10 V.Ip=10 A
• Low Gate Charge (Typ.45.6 nC)
•  Low Crss (Typ.27 pF)
• 100% Avalanche Tested
CATALOG
FDP20N50 COUNTRY OF ORIGIN  
FDP20N50 LIFECYCLE
FDP20N50 PARAMETRIC INFO
FDP20N50 PACKAGE INFO
FDP20N50 MANUFACTURING INFO
FDP20N50 PACKAGING INFO
FDP20N50 APPLICATIONS
COUNTRY OF ORIGIN
China
Korea (Republic of)
Taiwan (Province of China)
LIFECYCLE
Obsolete
Jun 21,2022
PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 500
Maximum Continuous Drain Current (A) 20
Maximum Gate Source Voltage (V) ±30
Maximum Drain Source Resistance (mOhm) 230@10V
Typical Gate Charge @ Vgs (nC) 45.6@10V
Typical Gate Charge @ 10V (nC) 45.6
Maximum Power Dissipation (mW) 250000
Process Technology UniFET
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 2400@25V
Typical Turn-On Delay Time (ns) 95
Typical Turn-Off Delay Time (ns) 100
Typical Fall Time (ns) 105
Typical Rise Time (ns) 375
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Threshold Voltage (V) 5
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
 
PACKAGE INFO
Supplier Package TO-220
Basic Package Type Through Hole
Pin Count 3
Lead Shape Through Hole
PCB 3
Tab Tab
Pin Pitch (mm) 2.67(Max)
Package Length (mm) 10.67(Max)
Package Width (mm) 4.7(Max)
Package Height (mm) 9.4(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 10.67(Max)
Package Overall Width (mm) 4.7(Max)
Package Overall Height (mm) 20.4(Max)
Seated Plane Height (mm) 20.4(Max)
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Transistor Outline Package
Package Family Name TO
Jedec TO-220AB
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFePAg
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 1000
 
APPLICATIONS
• LCD/LED/PDP TV
• Lighting
• Uninterruptible Power Supply
• AC-DC Power Supply


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