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CATALOG |
FFA60UP30DNTU COUNTRY OF ORIGIN |
FFA60UP30DNTU PARAMETRIC INFO
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FFA60UP30DNTU PACKAGE INFO
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FFA60UP30DNTU MANUFACTURING INFO
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FFA60UP30DNTU PACKAGING INFO
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FFA60UP30DNTU ECAD MODELS
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COUNTRY OF ORIGIN |
China |
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PARAMETRIC INFO
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Supplier packaging |
TO-3P |
Basic package type |
Through Hole |
Number of pins |
3 |
Pin shape |
Through Hole |
PCB |
3 |
ears |
ears |
Pin spacing (mm) |
5.45 |
Package length (mm) |
16.2(Max) |
Package width (mm) |
5(Max) |
Package height (mm) |
18.9(Max) |
Package diameter (mm) |
N/R |
Package Overall Length (mm) |
16.2(Max) |
Package Overall Width (mm) |
5(Max) |
Package Overall Height (mm) |
23.8(Max) |
Mounting surface height (mm) |
23.8(Max) |
Install |
Through Hole |
Package weight (g) |
not applicable |
Packaging materials |
Plastic |
package instruction |
Transistor Outline Package |
Package series name |
TO |
JEDEC |
not applicable |
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PACKAGE INFO
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Supplier packaging |
TO-3P |
Basic package type |
Through Hole |
Number of pins |
3 |
Pin shape |
Through Hole |
PCB |
3 |
ears |
ears |
Pin spacing (mm) |
5.45 |
Package length (mm) |
16.2(Max) |
Package width (mm) |
5(Max) |
Package height (mm) |
18.9(Max) |
Package diameter (mm) |
N/R |
Package Overall Length (mm) |
16.2(Max) |
Package Overall Width (mm) |
5(Max) |
Package Overall Height (mm) |
23.8(Max) |
Mounting surface height (mm) |
23.8(Max) |
Install |
Through Hole |
Package weight (g) |
not applicable |
Packaging materials |
Plastic |
package instruction |
Transistor Outline Package |
Package series name |
TO |
JEDEC |
not applicable |
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MANUFACTURING INFO
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MSL |
N/R |
Maximum reflow temperature (°C) |
N/R |
Reflow soldering time (seconds) |
N/R |
Maximum wave soldering temperature (°C) |
260 |
Wave soldering time (seconds) |
10 |
Wave soldering temperature source |
Link to datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Plating materials |
not applicable |
Terminal Base Material |
PU |
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PACKAGING INFO
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Packaging Suffix |
TU |
Package |
Tube |
Packing quantity |
450 |
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ECAD MODELS
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