FFA60UP30DNTU onsemi / Fairchild DIODE ARRAY GP 300V 30A TO3PN

label:
2024/02/26 253



CATALOG
FFA60UP30DNTU COUNTRY OF ORIGIN
FFA60UP30DNTU PARAMETRIC INFO
FFA60UP30DNTU PACKAGE INFO
FFA60UP30DNTU MANUFACTURING INFO
FFA60UP30DNTU PACKAGING INFO
FFA60UP30DNTU ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Supplier packaging TO-3P
Basic package type Through Hole
Number of pins 3
Pin shape Through Hole
PCB 3
ears ears
Pin spacing (mm) 5.45
Package length (mm) 16.2(Max)
Package width (mm) 5(Max)
Package height (mm) 18.9(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 16.2(Max)
Package Overall Width (mm) 5(Max)
Package Overall Height (mm) 23.8(Max)
Mounting surface height (mm) 23.8(Max)
Install Through Hole
Package weight (g) not applicable
Packaging materials Plastic
package instruction Transistor Outline Package
Package series name TO
JEDEC not applicable


PACKAGE INFO
Supplier packaging TO-3P
Basic package type Through Hole
Number of pins 3
Pin shape Through Hole
PCB 3
ears ears
Pin spacing (mm) 5.45
Package length (mm) 16.2(Max)
Package width (mm) 5(Max)
Package height (mm) 18.9(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 16.2(Max)
Package Overall Width (mm) 5(Max)
Package Overall Height (mm) 23.8(Max)
Mounting surface height (mm) 23.8(Max)
Install Through Hole
Package weight (g) not applicable
Packaging materials Plastic
package instruction Transistor Outline Package
Package series name TO
JEDEC not applicable


MANUFACTURING INFO
MSL N/R
Maximum reflow temperature (°C) N/R
Reflow soldering time (seconds) N/R
Maximum wave soldering temperature (°C) 260
Wave soldering time (seconds) 10
Wave soldering temperature source Link to datasheet
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material PU


PACKAGING INFO
Packaging Suffix TU
Package Tube
Packing quantity 450


ECAD MODELS

Продукт RFQ