|
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• Highly reliable connection and robust structure
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• Simplified operations
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• Increased FPC/FFC retention force
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• Accepts standard 0.3mm thick FPC/FFC
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• Fully molded structure aids PCB layout
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|
| CATALOG |
FH28-50S-0.5SH(05) COUNTRY OF ORIGIN
|
FH28-50S-0.5SH(05) PARAMETRIC INFO
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FH28-50S-0.5SH(05) PACKAGE INFO
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FH28-50S-0.5SH(05) MANUFACTURING INFO
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FH28-50S-0.5SH(05) PACKAGING INFO
|
FH28-50S-0.5SH(05) ECAD MODELS
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|
COUNTRY OF ORIGIN
|
Japan
|
|
PARAMETRIC INFO
|
| Type |
FFC/FPC Connector |
| Contact Gender |
SKT |
| Number of Contacts |
50 |
| Termination Method |
Solder |
| Maximum Current Rating (A) |
0.5 |
| Maximum Voltage Rating |
50VAC |
| Housing Material |
Liquid Crystal Polymer |
| Housing Color |
Gray |
| Contact Material |
Phosphor Bronze |
| Contact Plating |
Gold Over Nickel |
| Number of Rows |
1 |
| Maximum Contact Resistance (mOhm) |
50 |
| Insulation Resistance (MOhm) |
500 |
| Operating Temperature (°C) |
-40 to 105 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Mating Cycle (Cycles) |
20 |
| Minimum Storage Temperature (°C) |
-10 |
| Maximum Storage Temperature (°C) |
50 |
|
|
PACKAGE INFO
|
| Terminal Pitch (mm) |
0.5 |
| Body Orientation |
Right Angle |
| Mounting |
Surface Mount |
| Product Length (mm) |
29.9 |
| Product Depth (mm) |
7.2 |
| Product Height (mm) |
2.55 |
|
|
MANUFACTURING INFO
|
| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
Phosphor-Bronze |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
05 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
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