FOD8012AR2 onsemi / Fairchild OPTOISO 3.75KV 2CH PUSH PULL 8SO

label:
2023/11/7 240



• Half Duplex, Bi−Directional
• 20 kV/s Minimum Common Mode Rejection
• High Speed: ♦ 15 Mbit/s Date Rate (NRZ) ♦ 60 ns Maximum Propagation Delay ♦ 15 ns Maximum Pulse Width Distortion ♦ 30 ns Maximum Propagation Delay Skew
• 3.3 V and 5 V CMOS Compatibility
• Extended Industrial Temperate Range, −40 to +110°C Temperature Range
• Safety and Regulatory Approvals: ♦ UL1577, 3750 VACRMS for 1 min. ♦ DIN EN/IEC60747−5−5 (approval pending)


CATALOG
FOD8012AR2 COUNTRY OF ORIGIN
FOD8012AR2 PARAMETRIC INFO
FOD8012AR2 PACKAGE INFO
FOD8012AR2 PACKAGING INFO
FOD8012AR2 ECAD MODELS
FOD8012AR2 APPLICATIONS

COUNTRY OF ORIGIN
Japan
Thailand


PARAMETRIC INFO
Output Type Push-Pull
Number of Channels per Chip 2
Minimum Isolation Voltage (Vrms) 3750
Minimum Common Mode Rejection (kV/us) 20
Maximum Operating Supply Voltage (V) 3.6|5.5
Common Mode Voltage (V) 1000
Maximum Peak Output Current (A) 10
Maximum Fall Time (ns) 6.5(Typ)
Maximum Power Dissipation (mW) 60
Maximum Propagation Delay Time (tPHL) (ns) 60
Maximum Propagation Delay Time (tPLH) (ns) 60
Maximum Pulse Width Distortion (ns) 15
Maximum Rise Time (ns) 6.5(Typ)
Maximum Operating Temperature (°C) 110
Minimum Operating Temperature (°C) -40
Supplier Temperature Grade Extended Industrial
Minimum Operating Supply Voltage (V) 3|4.5
Maximum Storage Temperature (°C) 125
Minimum Storage Temperature (°C) -40
Maximum Data Rate 15Mbps


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5.13(Max)
Package Width (mm) 4.16(Max)
Package Height (mm) 3.43(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5.13(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 3.63(Max)
Seated Plane Height (mm) 3.63(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec N/A


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 2500
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Industrial Fieldbus Communications ♦ DeviceNet, CAN, RS485
• Microprocessor System Interface ♦ SPI, I2C
• Programmable Logic Control
• Isolated Data Acquisition System
• Voltage Level Translator

Продукт RFQ