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• Half Duplex, Bi−Directional
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• 20 kV/s Minimum Common Mode Rejection
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• High Speed:
♦ 15 Mbit/s Date Rate (NRZ)
♦ 60 ns Maximum Propagation Delay
♦ 15 ns Maximum Pulse Width Distortion
♦ 30 ns Maximum Propagation Delay Skew
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• 3.3 V and 5 V CMOS Compatibility
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• Extended Industrial Temperate Range, −40 to +110°C Temperature
Range
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• Safety and Regulatory Approvals:
♦ UL1577, 3750 VACRMS for 1 min.
♦ DIN EN/IEC60747−5−5 (approval pending)
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| CATALOG |
FOD8012AR2 COUNTRY OF ORIGIN
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FOD8012AR2 PARAMETRIC INFO
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FOD8012AR2 PACKAGE INFO
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FOD8012AR2 PACKAGING INFO
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FOD8012AR2 ECAD MODELS
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FOD8012AR2 APPLICATIONS
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COUNTRY OF ORIGIN
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Japan
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Thailand
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PARAMETRIC INFO
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| Output Type |
Push-Pull |
| Number of Channels per Chip |
2 |
| Minimum Isolation Voltage (Vrms) |
3750 |
| Minimum Common Mode Rejection (kV/us) |
20 |
| Maximum Operating Supply Voltage (V) |
3.6|5.5 |
| Common Mode Voltage (V) |
1000 |
| Maximum Peak Output Current (A) |
10 |
| Maximum Fall Time (ns) |
6.5(Typ) |
| Maximum Power Dissipation (mW) |
60 |
| Maximum Propagation Delay Time (tPHL) (ns) |
60 |
| Maximum Propagation Delay Time (tPLH) (ns) |
60 |
| Maximum Pulse Width Distortion (ns) |
15 |
| Maximum Rise Time (ns) |
6.5(Typ) |
| Maximum Operating Temperature (°C) |
110 |
| Minimum Operating Temperature (°C) |
-40 |
| Supplier Temperature Grade |
Extended Industrial |
| Minimum Operating Supply Voltage (V) |
3|4.5 |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Data Rate |
15Mbps |
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PACKAGE INFO
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| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5.13(Max) |
| Package Width (mm) |
4.16(Max) |
| Package Height (mm) |
3.43(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.13(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
3.63(Max) |
| Seated Plane Height (mm) |
3.63(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
N/A |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Industrial Fieldbus Communications
♦ DeviceNet, CAN, RS485
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| • Microprocessor System Interface
♦ SPI, I2C |
| • Programmable Logic Control |
| • Isolated Data Acquisition System |
• Voltage Level Translator
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