
|
|
• High current carrying capacity
|
• Low core loss
|
• Magnetically shielded
|
• Tight tolerance DCR for sensing circuits
|
• Inductance Range from 100 nH to 300 nH
|
• Current range from 36 A to 103 A
|
• 10.8 mm x 8.0 mm footprint surface mount package in an 8.0 mm height
|
• Moisture Sensitivity Level: 1
|
|
| CATALOG |
FP1008R6-R150-R COUNTRY OF ORIGIN
|
FP1008R6-R150-R PARAMETRIC INFO
|
FP1008R6-R150-R PACKAGE INFO
|
FP1008R6-R150-R MANUFACTURING INFO
|
FP1008R6-R150-R PACKAGING INFO
|
FP1008R6-R150-R APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Philippines
|
|
PARAMETRIC INFO
|
| Type |
Power |
| Technology |
Wirewound |
| Protection Style |
Shielded |
| Core Material |
Ferrite |
| Inductance (H) |
0.15u(OCL)/0.108u |
| Tolerance |
10% |
| Inductance Test Frequency (Hz) |
100K |
| Maximum DC Current (A) |
74 |
| Typical Temperature Rise (°C) |
40 |
| Maximum Saturation Current (A) |
85 |
| Inductance Decrease Percentage @ Isat (%) |
20 |
| Maximum DC Resistance (Ohm) |
0.00018(Typ) |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-40 |
| Operating Temperature (°C) |
-40 to 125 |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-40 |
|
|
PACKAGE INFO
|
| Case Size |
N/A |
| Maximum Product Length (mm) |
10.8 |
| Maximum Product Depth (mm) |
8 |
| Maximum Product Height (mm) |
8 |
| Maximum Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
2.97 |
| Terminal Pitch (mm) |
N/R |
| Mounting |
Surface Mount |
| Product Diameter (mm) |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Lead Finish(Plating) |
N/A |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Packaging Document |
Link to Datasheet |
|
|
APPLICATIONS
|
| • Multi-phase and Vcore regulators |
| • Voltage Regulator Modules (VRMs) and high power density VRMs• Server and desktop• Central processing unit (CPU)• Graphics processing unit (GPU)• Application specific integrated circuit (ASIC) |
| • Data networking and storage systems |
| • Graphics cards and battery power systems |
| • Point-of-Loadmodules (POL) |
| • DCR sensing circuits |
| |