|
|
• 1.8 to 5.5 V Input Voltage Range
|
• Controlled Turn−On
|
• 50 mA and 100 mA Current Limit Options
|
• Undervoltage Lockout
|
• Thermal Shutdown
|
| • <1 A Shutdown Current |
| • Auto Restart |
| • Fast Current Limit Response Time
♦ 3 s to Moderate Over Currents
♦ 20 ns to Hard Shorts |
| • Fault Blanking+ |
| • These Devices are Pb−Free and are RoHS Compliant |
|
| CATALOG |
FPF2000 COUNTRY OF ORIGIN
|
| FPF2000 LIFECYCLE |
FPF2000 PARAMETRIC INFO
|
FPF2000 PACKAGE INFO
|
FPF2000 MANUFACTURING INFO
|
FPF2000 PACKAGING INFO
|
FPF2000 ECAD MODELS
|
| FPF2000 FUNCTIONAL BLOCK DIAGRAM |
FPF2000 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
Philippines
|
| Thailand |
| China |
|
| LIFECYCLE |
Obsolete
Dec 30,2022 |
|
PARAMETRIC INFO
|
| Number of Outputs |
1 |
| Number of Inputs |
1 |
| Minimum Input Voltage (V) |
1.8 |
| Maximum Input Voltage (V) |
5.5 |
| Maximum Output Current (A) |
0.075(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Switch On Resistance (mOhm) |
700 |
| Maximum Power Dissipation (mW) |
250 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2 |
| Package Width (mm) |
1.25 |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2 |
| Package Overall Width (mm) |
2.1 |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-203AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
CuFeZnP |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| FUNCTIONAL BLOCK DIAGRAM |
|
|
APPLICATIONS
|
• PDAs
|
| • Cell Phones |
• GPS Devices
|
| • MP3 Players |
| • Digital Cameras |
| • Peripheral Ports |
| • Hot Swap Supplies |
| |
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