|
|
• 2.8 V to 36 V Input Voltage Range
|
• Typical RDS(ON) = 88 m
|
• 0.4 A to 2 A Adjustable Current Limit (Min.)
|
• Slew Rate Controlled
|
• ESD Protected, Above 2000 V HBM
|
• Thermal Shutdown
|
• Active LOW Enable
|
• UVLO Protection
|
• Power−Good Output
|
• These are Pb−Free Devices
|
|
| CATALOG |
FPF2700MPX LIFECYCLE
|
FPF2700MPX PARAMETRIC INFO
|
FPF2700MPX PACKAGE INFO
|
FPF2700MPX MANUFACTURING INFO
|
FPF2700MPX PACKAGING INFO
|
FPF2700MPX ECAD MODELS
|
FPF2700MPX APPLICATIONS
|
|
LIFECYCLE
|
Obsolete
Dec 15,2023
|
|
PARAMETRIC INFO
|
| Number of Outputs |
1 |
| Number of Inputs |
1 |
| Minimum Input Voltage (V) |
2.8 |
| Maximum Input Voltage (V) |
36 |
| Maximum Output Current (A) |
2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Switch On Resistance (mOhm) |
88 |
| Maximum Power Dissipation (mW) |
1250 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
MLP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.8(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Micro Lead Frame Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-229 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
PdNiAg |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
X |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Motor Drives |
| • Digital Cameras |
| • Consumer Electronics |
| • Industrial |
| • Computing |
| • Hard Disk Drives |
| • Telecom Equipment |
| |
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