FQB34P10TM onsemi / Fairchild MOSFET P-CH 100V 33.5A D2PAK

label:
2023/11/1 338


• -33.5 A,-100 V, RDS(on) = 60 mΩ (Max.)@VGs =.10 V,ID=-16.7A
• Low Gate Charge (Typ.85 nC)
• Low Crss (Typ. 170 pF)
• 100% Avalanche Tested
• 175°C Maximum Junction Temperature Rating


CATALOG
FQB34P10TM COUNTRY OF ORIGIN
FQB34P10TM PARAMETRIC INFO
FQB34P10TM PACKAGE INFO
FQB34P10TM MANUFACTURING INFO
FQB34P10TM PACKAGING INFO
FQB34P10TM ECAD MODELS


COUNTRY OF ORIGIN
China
Czechia
Japan
Korea (Republic of)
Malaysia


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 100
Maximum Continuous Drain Current (A) 33.5
Maximum Gate Source Voltage (V) ±25
Maximum Drain Source Resistance (mOhm) 60@10V
Typical Gate Charge @ Vgs (nC) 85@10V
Typical Gate Charge @ 10V (nC) 85
Maximum Power Dissipation (mW) 3750
Process Technology DMOS
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 2240@25V
Typical Turn-On Delay Time (ns) 25
Typical Turn-Off Delay Time (ns) 160
Typical Fall Time (ns) 210
Typical Rise Time (ns) 250
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Threshold Voltage (V) 4
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 175
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 175
 
PACKAGE INFO
Supplier Package D2PAK
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 2
Tab Tab
Pin Pitch (mm) 2.54
Package Length (mm) 10.67(Max)
Package Width (mm) 9.65(Max)
Package Height (mm) 4.83(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 10.67(Max)
Package Overall Width (mm) 15.88(Max)
Package Overall Height (mm) 5.08(Max)
Seated Plane Height (mm) 5.08(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Double Deca Watt Package
Package Family Name TO-263
Jedec TO-263AB
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 245
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Suffix TM
Packaging Tape and Reel
Quantity Of Packaging 800
 
ECAD MODELS


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