FT2232HL-REEL FTDI IC USB HS DUAL UART/FIFO 64-LQFP

label:
2024/01/15 273



• Single chip USB to dual serial / parallel ports with a variety of configurations.
• Entire USB protocol handled on the chip. No USB specific firmware programming required.  
• USB 2.0 High Speed (480Mbits/Second) and Full Speed (12Mbits/Second) compatible.
• Dual Multi-Protocol Synchronous Serial Engine (MPSSE) to simplify synchronous serial protocol (USB to JTAG, I2C, SPI or bit-bang) design.  
• Dual independent UART or FIFO or MPSSE ports.
• Independent Baud rate generators.  
• RS232/RS422/RS485 UART Transfer Data Rate up to 12Mbaud. (RS232 Data Rate limited by external level shifter).
• USB to parallel FIFO transfer data rate up to 8 Mbyte/Sec.  
• Single channel synchronous FIFO mode for transfers upto 40 Mbytes/Sec
• CPU-style FIFO interface mode simplifies CPU interface design.  
• MCU host bus emulation mode configuration option.
• Fast Opto-Isolated serial interface option.  
• FTDI’s royalty-free Virtual Com Port (VCP) and Direct (D2XX) drivers eliminate the requirement for USB driver development in most cases.
• Adjustable receive buffer timeout.  
• Option for transmit and receive LED drive signals on each channel.  
• Enhanced bit-bang Mode interface option with RD# and WR# strobes
• FT245B-style FIFO interface option with bidirectional data bus and simple 4 wire handshake interface.
• Highly integrated design includes +1.8V LDO regulator for VCORE, integrated POR function and on chip clock multiplier PLL (12MHz – 480MHz).  
• Asynchronous serial UART interface option with full hardware handshaking and modem interface signals.
• Fully assisted hardware or X-On / X-Off software handshaking.  
• UART Interface supports 7/8 bit data, 1/2 stop bits, and Odd/Even/Mark/Space/No Parity.
• Auto-transmit enable control for RS485 serial applications using TXDEN pin.  
• Operational configuration mode and USB Description strings configurable in external EEPROM over the USB interface.
• Configurable I/O drive strength (4, 8, 12 or 16mA) and slew rate.  
• Low operating and USB suspend current.
• Supports bus powered, self-powered and highpower bus powered USB configurations.
• UHCI/OHCI/EHCI host controller compatible.   
• USB Bulk data transfer mode (512 byte packets in High Speed mode).
• +1.8V (chip core) and +3.3V I/O interfacing (+5V Tolerant).  
• Extended -40°C to 85°C industrial operating temperature range.
• Compact 64-LD Lead Free LQFP or QFN package
• Available in compact Pb-free 56 Pin VQFN packages (RoHS compliant)  
• +3.3V single supply operating voltage range.  
• ESD protection for FT2232H IO’s: Human Body Model (HBM) ±2kV, Machine Mode (MM) ±200V, Charge Device Model (CDM) ±500V, Latch-up free.  



CATALOG
FT2232HL-REEL COUNTRY OF ORIGIN
FT2232HL-REEL PARAMETRIC INFO
FT2232HL-REEL PACKAGE INFO
FT2232HL-REEL MANUFACTURING INFO
FT2232HL-REEL PACKAGING INFO
FT2232HL-REEL FUNCTIONAL BLOCK DIAGRAM  
FT2232HL-REEL APPLICATIONS



COUNTRY OF ORIGIN
Indonesia



PARAMETRIC INFO
Typical Supply Current (mA) 70
Maximum Operating Temperature (°C) 85
Maximum Operating Supply Voltage (V) 1.98|3.6
Minimum Operating Supply Voltage (V) 1.62|3
Typical Operating Supply Voltage (V) 1.8|3.3
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -40
Minimum Storage Temperature (°C) -65
Supplier Temperature Grade Industrial
Protocols Supported USB 2.0
Maximum Data Rate (Mbps) 480
Interface Type I2C/UART
Maximum Operating Frequency (MHz) 12(Typ)
USB Speed Type High Speed
Type USB to UART/FIFO
Process Technology CMOS
USB Transceiver Yes
 


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 64
Lead Shape Gull-wing
PCB 64
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 10
Package Width (mm) 10
Package Height (mm) 1.4
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BCD
Package Outline Link to Datasheet
 


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30 to 40
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Olin 7025
Number of Wave Cycles N/R
 


PACKAGING INFO
Packaging Suffix REEL
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 13
Reel Width (mm) 24.8
Tape Pitch (mm) 16
Tape Width (mm) 24
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q2
Packaging Document Link to Datasheet
 


FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
• Single chip USB to dual channel UART (RS232, RS422 or RS485).
• Single chip USB to dual channel FIFO.
• Single chip USB to dual channel JTAG.  
• Single chip USB to dual channel SPI.  
• Single chip USB to dual channel I2C.  
• Single chip USB to dual channel Bit-Bang.
• Single chip USB to dual combination of any of above interfaces.  
• Single chip USB to Fast Serial Optic Interface.  
• Single chip USB to CPU target interface (as memory), double and independent.
• Single chip USB to Host Bus Emulation (as CPU).  
• PDA to USB data transfer
• USB Smart Card Readers  
• USB Instrumentation  
• USB Industrial Control  
• USB MP3 Player Interface  
• USB FLASH Card Reader / Writers  
• Set Top Box PC - USB interface  
• USB Digital Camera Interface  
• USB Bar Code Readers

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