|
|
• Single chip USB to dual serial / parallel ports
with a variety of configurations. |
• Entire USB protocol handled on the chip. No
USB specific firmware programming required.
|
• USB 2.0 High Speed (480Mbits/Second) and
Full Speed (12Mbits/Second) compatible. |
• Dual Multi-Protocol Synchronous Serial Engine
(MPSSE) to simplify synchronous serial protocol
(USB to JTAG, I2C, SPI or bit-bang) design.
|
• Dual independent UART or FIFO or MPSSE
ports. |
• Independent Baud rate generators.
|
• RS232/RS422/RS485 UART Transfer Data Rate
up to 12Mbaud. (RS232 Data Rate limited by
external level shifter). |
• USB to parallel FIFO transfer data rate up to 8
Mbyte/Sec.
|
• Single channel synchronous FIFO mode for
transfers upto 40 Mbytes/Sec |
• CPU-style FIFO interface mode simplifies CPU
interface design.
|
• MCU host bus emulation mode configuration
option. |
• Fast Opto-Isolated serial interface option.
|
• FTDI’s royalty-free Virtual Com Port (VCP) and
Direct (D2XX) drivers eliminate the
requirement for USB driver development in
most cases. |
• Adjustable receive buffer timeout.
|
• Option for transmit and receive LED drive
signals on each channel.
|
• Enhanced bit-bang Mode interface option with
RD# and WR# strobes |
• FT245B-style FIFO interface option with bidirectional data bus and simple 4 wire
handshake interface. |
• Highly integrated design includes +1.8V LDO
regulator for VCORE, integrated POR function
and on chip clock multiplier PLL (12MHz –
480MHz).
|
• Asynchronous serial UART interface option with
full hardware handshaking and modem
interface signals.
|
• Fully assisted hardware or X-On / X-Off
software handshaking.
|
• UART Interface supports 7/8 bit data, 1/2 stop
bits, and Odd/Even/Mark/Space/No Parity. |
• Auto-transmit enable control for RS485 serial
applications using TXDEN pin.
|
• Operational configuration mode and USB
Description strings configurable in external
EEPROM over the USB interface. |
• Configurable I/O drive strength (4, 8, 12 or
16mA) and slew rate.
|
• Low operating and USB suspend current. |
• Supports bus powered, self-powered and highpower bus powered USB configurations. |
• UHCI/OHCI/EHCI host controller compatible.
|
• USB Bulk data transfer mode (512 byte packets
in High Speed mode). |
• +1.8V (chip core) and +3.3V I/O interfacing
(+5V Tolerant). |
• Extended -40°C to 85°C industrial operating
temperature range. |
• Compact 64-LD Lead Free LQFP or QFN
package |
• Available in compact Pb-free 56 Pin VQFN
packages (RoHS compliant)
|
• +3.3V single supply operating voltage range.
|
• ESD protection for FT2232H IO’s:
Human Body Model (HBM) ±2kV,
Machine Mode (MM) ±200V,
Charge Device Model (CDM) ±500V,
Latch-up free. |
|
CATALOG |
FT2232HL-REEL COUNTRY OF ORIGIN |
FT2232HL-REEL PARAMETRIC INFO |
FT2232HL-REEL PACKAGE INFO |
FT2232HL-REEL MANUFACTURING INFO |
FT2232HL-REEL PACKAGING INFO |
FT2232HL-REEL FUNCTIONAL BLOCK DIAGRAM
|
FT2232HL-REEL APPLICATIONS |
|
COUNTRY OF ORIGIN |
Indonesia |
|
PARAMETRIC INFO |
Typical Supply Current (mA) |
70 |
Maximum Operating Temperature (°C) |
85 |
Maximum Operating Supply Voltage (V) |
1.98|3.6 |
Minimum Operating Supply Voltage (V) |
1.62|3 |
Typical Operating Supply Voltage (V) |
1.8|3.3 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-40 |
Minimum Storage Temperature (°C) |
-65 |
Supplier Temperature Grade |
Industrial |
Protocols Supported |
USB 2.0 |
Maximum Data Rate (Mbps) |
480 |
Interface Type |
I2C/UART |
Maximum Operating Frequency (MHz) |
12(Typ) |
USB Speed Type |
High Speed |
Type |
USB to UART/FIFO |
Process Technology |
CMOS |
USB Transceiver |
Yes |
|
|
PACKAGE INFO |
Supplier Package |
LQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
64 |
Lead Shape |
Gull-wing |
PCB |
64 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
10 |
Package Width (mm) |
10 |
Package Height (mm) |
1.4 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.6(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Low Profile Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026BCD |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO |
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 to 40 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Olin 7025 |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO |
Packaging Suffix |
REEL |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
24.8 |
Tape Pitch (mm) |
16 |
Tape Width (mm) |
24 |
Feed Hole Pitch (mm) |
4 |
Hole Center to Component Center (mm) |
2 |
Component Orientation |
Q2 |
Packaging Document |
Link to Datasheet |
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
APPLICATIONS |
• Single chip USB to dual channel UART (RS232,
RS422 or RS485). |
• Single chip USB to dual channel FIFO. |
• Single chip USB to dual channel JTAG. |
• Single chip USB to dual channel SPI.
|
• Single chip USB to dual channel I2C.
|
• Single chip USB to dual channel Bit-Bang. |
• Single chip USB to dual combination of any of
above interfaces.
|
• Single chip USB to Fast Serial Optic Interface.
|
• Single chip USB to CPU target interface (as
memory), double and independent. |
• Single chip USB to Host Bus Emulation (as
CPU).
|
• PDA to USB data transfer |
• USB Smart Card Readers
|
• USB Instrumentation
|
• USB Industrial Control |
• USB MP3 Player Interface
|
• USB FLASH Card Reader / Writers
|
• Set Top Box PC - USB interface
|
• USB Digital Camera Interface
|
• USB Bar Code Readers |
|
|