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CATALOG |
FT232HL-REEL PARAMETRIC INFO
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FT232HL-REEL PACKAGE INFO
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FT232HL-REEL MANUFACTURING INFO
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FT232HL-REEL PACKAGING INFO
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FT232HL-REEL EACD MODELS
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PARAMETRIC INFO
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Typical Supply Current (mA) |
30 |
Maximum Operating Temperature (°C) |
85 |
Maximum Operating Supply Voltage (V) |
3.6 |
Minimum Operating Supply Voltage (V) |
3 |
Typical Operating Supply Voltage (V) |
3.3 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-40 |
Minimum Storage Temperature (°C) |
-65 |
Protocols Supported |
USB 2.0 |
Maximum Data Rate (Mbps) |
480 |
Interface Type |
I2C/GPIO/SPI/UART |
USB Speed Type |
Full Speed|High Speed |
Type |
USB Interface Device |
USB Transceiver |
Yes |
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PACKAGE INFO
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Supplier Package |
LQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
48 |
Lead Shape |
Gull-wing |
PCB |
48 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
7 |
Package Width (mm) |
7 |
Package Height (mm) |
1.4 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.6(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Low Profile Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026BBC |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 to 40 |
Number of Reflow Cycle |
3 |
Standard |
N/A |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Sn |
Under Plating Material |
N/R |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging Suffix |
REEL |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
16.5 |
Tape Pitch (mm) |
12 |
Tape Width (mm) |
16 |
Feed Hole Pitch (mm) |
4 |
Hole Center to Component Center (mm) |
2 |
Component Orientation |
Q2 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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