|
|
• Single chip USB to asynchronous serial data
transfer interface.
|
• Entire USB protocol handled on the chip. No
USB specific firmware programming required.
|
• Fully integrated 1024 bit EEPROM storing
device descriptors and CBUS I/O configuration.
|
• Fully integrated USB termination resistors.
|
• Fully integrated clock generation with no
external crystal required plus optional clock
output selection enabling a glue-less interface
to external MCU or FPGA.
|
• Data transfer rates from 300 baud to 3 Mbaud
(RS422, RS485, RS232) at TTL levels.
|
• 128 byte receive buffer and 256 byte transmit
buffer utilising buffer smoothing technology to
allow for high data throughput.
|
• FTDI’s royalty-free Virtual Com Port (VCP) and
Direct
(D2XX)
drivers
eliminate
the
requirement for USB driver development in
most cases.
|
• Unique USB FTDIChip-ID™ feature.
|
• Configurable CBUS I/O pins.
|
• Transmit and receive LED drive signals.
|
• UART interface support for 7 or 8 data bits, 1
or 2 stop bits and odd / even / mark / space /
no parity
|
|
| CATALOG |
| FT232RL-Reel COUNTRY OF ORIGIN |
FT232RL-Reel PACKAGE INFO
|
FT232RL-Reel MANUFACTURING INFO
|
FT232RL-Reel PACKAGING INFO
|
FT232RL-Reel FUNCTIONAL BLOCK DIAGRAM
|
FT232RL-Reel APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| USA |
China
|
Czechia
|
Indonesia
|
Philippines
|
Taiwan (Province of China)
|
Viet Nam
|
|
PACKAGE INFO
|
| Supplier Package |
SSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
10.2 |
| Package Width (mm) |
5.3 |
| Package Height (mm) |
1.75 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Shrink Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
MO-150AH |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
24.5 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
24 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
APPLICATIONS
|
• USB to RS232/RS422/RS485 Converters
|
• Upgrading Legacy Peripherals to USB
|
• Cellular and Cordless Phone USB data transfer
cables and interfaces
|
• Camcorders, Personal Stereos, Cameras
|
• Interfacing MCU/PLD/FPGA based designs to
USB
|
•USB Audio and Low Bandwidth Video data
transfer
|
| •PDA to USB data transfer |
•USB Smart Card Readers
|
•USB Instrumentation
|
| |
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