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| CATALOG |
FT234XD-R COUNTRY OF ORIGIN
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FT234XD-R PARAMETRIC INFO
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FT234XD-R PACKAGE INFO
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FT234XD-R MANUFACTURING INFO
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FT234XD-R PACKAGING INFO
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FT234XD-R ECAD MODELS
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FT234XD-R APPLICATIONS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Typical Supply Current (mA) |
8 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Operating Supply Voltage (V) |
3.63|5.5 |
| Minimum Operating Supply Voltage (V) |
1.62|2.97 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-65 |
| Protocols Supported |
USB 2.0 |
| Maximum Data Rate (Mbps) |
3 |
| Interface Type |
UART/USB |
| Maximum Operating Frequency (MHz) |
12.02 |
| USB Speed Type |
Full Speed |
| Type |
USB to Basic UART IC |
| USB Transceiver |
Yes |
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PACKAGE INFO
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| Supplier Package |
DFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
12 |
| Lead Shape |
No Lead |
| PCB |
12 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.45 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.25 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Dual Flat Package No Lead, Exposed Pad |
| Package Family Name |
DFN |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.5 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• USB to RS232/RS422/RS485 Converters.
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• Upgrading Legacy Peripherals to USB.
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| • Utilising USB to add system modularity. |
| • Incorporate USB interface to enable PC transfers for development system communication. |
| • Cellular and Cordless Phone USB data transfer cables and interfaces. |
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