Gali-21+ Mini-Circuits IC AMP CELLULAR 0HZ-8GHZ SOT89

label:
2025/09/15 16
Gali-21+ Mini-Circuits IC AMP CELLULAR 0HZ-8GHZ SOT89


• Frequency Range, DC to 8 GHz
• InGap HBT Microwave Amplifier
• Miniature SOT-89 Package
• Internally Matched to 50Ω
• Output Power, +12.6 dBm Typ.


CATALOG
GALI-21+ COUNTRY OF ORIGIN
GALI-21+ PARAMETRIC INFO
GALI-21+ PACKAGE INFO
GALI-21+ MANUFACTURING INFO
GALI-21+ PACKAGING INFO
GALI-21+ APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Manufacturer Type Wideband Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 9@8000MHz
Typical Noise Figure (dB) 4@2000MHz
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 12.6
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 27
Typical Output Intercept Point (dBm) 27@2000MHz
Maximum Operating Frequency (MHz) 8000
Typical Output Power (dBm) 12.6@2000MHz
Typical Output Power Range (dBm) 10 to 15
Maximum Input Return Loss (dB) 14(Typ)@8000MHz
Maximum Output Return Loss (dB) 7.5(Typ)@8000MHz
Power Supply Type Single
Minimum Single Supply Voltage (V) 3
Typical Single Supply Voltage (V) 3.5
Maximum Single Supply Voltage (V) 4.1
Maximum Operating Supply Voltage (V) 4.1
Maximum Supply Current (mA) 40(Typ)
Minimum Operating Temperature (°C) -45
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package SOT-89
Basic Package Type Lead-Frame SMT
Pin Count 4
Lead Shape Flat
PCB 3
Tab Tab
Pin Pitch (mm) 1.5
Package Length (mm) 4.6(Max)
Package Width (mm) 2.59(Max)
Package Height (mm) 1.6(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Terminal Width (mm) 0.41|0.48|1.65
Package Weight (g) 0.2
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-243AA
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 1.6
Minimum PACKAGE_DIMENSION_H N/A
Maximum PACKAGE_DIMENSION_L 4.6
Minimum PACKAGE_DIMENSION_L 4.39
Maximum PACKAGE_DIMENSION_W 2.59
Minimum PACKAGE_DIMENSION_W 2.29
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.6
Minimum Seated_Plane_Height N/A


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Reel Diameter (in) 7
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Tab At Sprocket Hole
Packaging Document Link to Datasheet

APPLICATIONS
• Cellular
• PCS
• Communication Receivers & Transmitters
Продукт RFQ