GD25Q64EWIGR GigaDevice IC FLASH 64MBIT SPI/QUAD 8WSON

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2025/05/27 2
GD25Q64EWIGR GigaDevice IC FLASH 64MBIT SPI/QUAD 8WSON


CATALOG
GD25Q64EWIGR PARAMETRIC INFO
GD25Q64EWIGR PACKAGE INFO
GD25Q64EWIGR MANUFACTURING INFO
GD25Q64EWIGR PACKAGING INFO


PARAMETRIC INFO
Density (bit) 64M
Cell Type NOR
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block No
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 7
Programmability Yes
Typical Operating Supply Voltage (V) 3|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 8
Number of Words 8M
Maximum Supply Current (mA) 25
Programming Voltage (V) 2.7 to 3.6
Sector Size 4Kbyte x 2048
Program Current (mA) 25
Address Width (bit) 24
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 60/Chip
Maximum Programming Time (ms) 2.4/Page
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Page Size 256byte
Density in Bits (bit) 67108864


PACKAGE INFO
Supplier Package WSON EP
Pin Count 8
PCB 8
Tab N/R
Package Length (mm) 5
Package Width (mm) 6
Package Height (mm) 0.73
Package Diameter (mm) N/R
Mounting Surface Mount
Package Family Name SON
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020E
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Shelf Life Period 12 Month
Shelf Life Condition 40°C+90 % RH
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Packaging Document Link to Datasheet


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